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Heidelberg Instruments Mikrotechnik GmbH

Mittelgewannweg 27
Heidelberg,  69123

Germany
https://heidelberg-instruments.com/
  • Booth: B1371


Experience the power of direct writing.

With over 40 years of experience and 1,500+ systems installed worldwide, Heidelberg Instruments is a global leader in high-precision laser lithography systems, maskless aligners, and nanofabrication tools. Our portfolio spans from compact tabletop solutions for prototyping, R&D, and small series production to advanced photomask manufacturing equipment for high-volume industrial use. This broad offering enables support for a wide spectrum of micro- and nanoscale surface structuring techniques, including 2D patterning and 2.5D features via grayscale lithography. Trusted by leading universities, research institutes, and industrial facilities, our systems are used in micro-optics, photonics, electronics, sensors, semiconductors, advanced packaging, next-gen displays, quantum devices, MEMS, microfluidics, 2D materials, photomask production, and more.

 Products

  • MLA 300 MASKLESS ALIGNER FOR VOLUME PRODUCTION
    The MLA 300 Maskless Aligner integrates seamlessly into fully automated production lines with resolutions down to 1.5 µm. Areas of application are advanced semiconductor packaging, IR sensors, MEMS, electronic probes, high-precision electronic components....

    • MLA 300 Maskless Aligner

    Optimized for industrial manufacturing, the MLA 300 Maskless Aligner features distinct benefits for the wafer-level technology: The flexibility of maskless lithography allows rapid design customizations, and even unique designs on each substrate. This is of particular use for chip packaging where mounted die shift and each panel is unique. Meeting these demands, the MLA 300 can be seamlessly integrated into wafer-level packaging production lines, fully automating wafer production with a resolution down to 2 µm lines and spaces. The MLA 300 reduces production costs and efforts by eliminating mask procurement, verification, and management requirements. Operating costs are reduced by utilizing a long-lifetime exposure laser and fewer consumables. Modularity enables fast maintenance, replacement, or repair. Real-time autofocus compensates substrate warp or corrugations for flawless patterning.

    Product Highlights

    Direct-write Lithography

    No mask-related costs, effort, or security risks

    Flexibility

    Direct writing in industrial production allows per-die pattern corrections, e.g. to react to distortions or process variations and serialization

    Time-saving

    Shorter time from prototyping to production. Digital design management replaces conventional mask library

    Exposure Quality

    Optical compensation of scaling, rotation; patented substrate tracking technology

    Dynamic Autofocus

    Superior critical dimensions (CD) uniformity on warped or corrugated substrates

    Exposure Speed

    300 x 300 mm2 in 19 minutes

    Full Facility Integration

    Customizable automatic loader, substrate chuck including warped substrates, custom workflow “wizards” and interface with manufacturing execution systems (MES)

    User-friendly

    SEMI-compliant user interface; customized workflow “wizards” for system operators
  • DWL 4000 GS – THE INDUSTRIAL-LEVEL GRAYSCALE TOOL
    The expert Grayscale (GS) Lithography tool DWL 4000 GS provides advanced Grayscale technology that satisfies the highest industrial standards and produces 2.5D or freeform topographies such as micro-lenses or sloping features like blazed gratings....

    • DWL 4000 GS Grayscale Tool

    The DWL 4000 GS laser lithography systems is a fast and flexible high-resolution pattern generator, optimized for industrial-level grayscale lithography and designed for high-throughput patterning of masks and wafers for integrated circuits, MEMS, micro-optic and microfluidic devices, sensors, holograms and security features on banknotes and ID cards.

    The Professional Grayscale Lithography Mode enables patterning of complex 2.5D structures in thick photoresist over large areas. With a minimum feature size of 500 nm, a write area of 400 mm x 400 mm and optional automatic loading system, the DWL 4000 GS systems is particularly suitable for wafer-level micro-optics used for telecommunications, illumination and industrial display manufacturing.

    Exposure Quality

    CD uniformity 60 nm; edge roughness 40 nm; alignment accuracy 60 nm; 2nd layer alignment 250 nm; autofocus compensation 80 µm

    Grayscale Lithography

    1000 gray levels; dedicated GenISys BEAMER software for optimizing the exposure of complex geometries

    Temperature-controlled Flow Box

    Temperature stability ± 0.1°, ISO 4 environment

    Exposure Speed

    area of 200 x 200 mm2 in grayscale mode in <60 minutes

    Large Substrate Size

    Up to 20 / 40 cm
  • NEW! VPG 300 DI Maskless Stepper
    The new VPG 300 DI Maskless Stepper is a Volume Pattern Generator specifically designed for direct writing of high-accuracy and high-resolution microstructures in i-line resists, for use in academic and industrial R&D, or low-volume production....

    • VPG 300 DI Maskless Stepper

    Exposure Speed

    Custom made high-speed spatial light modulator; optimized optical engine performance and data path. Can write a 100 x 100 mm2 area in 9 minutes

    Exposure Quality

    Edge roughness < 40 nm, CD uniformity < 60 nm, resolution down to 500 nm

    Alignment Accuracy

    2nd layer alignment (topside) down to 100 nm, backside VIS / IR ±1 µm

    Automated Alignment

    Automated global and local alignment with distortion corrections; VIS backside alignment; IR alignment for buried structures

    Autofocus

    Optical or pneumatic autofocus with dynamic compensation up to 80 µm

    Included metrology functions

    Position, CD and edge roughness

    Writing Stability

    Integrated ambient metrology, flowbox, and software corrections to compensate environmental changes

Categories

200 Packaging and Assembly Equipment
  • Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners
    • 204 MEMS Equipment
  • Double sided mask aligner
    • 205 Nanotechnology Equipment and Tools
  • Equipment, Nanotechnology Tools
    • 207 Process Equipment
  • Lithography; Exposure; Aligners; Direct Write Systems; Steppers; Scanners; Nanoimprint
    • 700 Manufacturing Services
  • Lithography; Patterning service

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