Provider flexible solution for inflexible applications.
Since pioneering the use of flexible epoxy technology for microelectronic packaging in 1985, AI
Technology, Inc. (AIT) has been one of the leading forces in the development of patented
applications of advanced material and adhesive solutions for electronic interconnection and
packaging.
In addition, AIT has more than 35 years of experience in successfully helping military,
aerospace, computer, and super-computer manufacturers with thermal compound and thermal
interface materials for building some of the most reliable electronic devices and computers.
AIT continues to provide adhesive solutions for component and substrate bonding for both
military and commercial applications and boasts one of the most comprehensive film and paste
adhesive lines to help our customers build their products with the greatest reliability at the
lowest cost of manufacturing. Our patented phase-change thermal pads, thermal greases and
gels, and thermal adhesives have also set many performance and dependability benchmarks for
power semiconductor and modules, computer, and communication electronics.