ERS Electronic GmbH

Stettiner Str. 3 + 5
Germering (Munich),  D-82110

  • Booth: B1736

Industry leader in thermal management solutions

ERS has been supplying innovative thermal test solutions to the semiconductor industry since 1970 and is famous for fast-ramping and precise low-noise thermal systems (-65°C to +400°C) for analytical, parametric and wafer sort probing up to 300mm.  The patented ERS flagship product for hot/cold wafer test, AC3, is available for package-level tri-temp applications for MEMS test.  ERS designs and builds stand-alone thermal-forcing systems and custom production tools for difficult thermal applications. ERS also supplies the advanced wafer level packaging market with its fully automatic debonders and warpage adjust tools used in the production of both 200mm and 300mm eWLB device packages. On a broader scale, ERS supports not only eWLB but many other Fan-Out Wafer- and Panel-Level Packaging (FOWLP & FOPLP) technologies.  

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