Fraunhofer IMS - Institute for Microelectronic Circuits and Systems
Welcome to Fraunhofer IMS at booth 170 in Hall 2.
The Fraunhofer Institute for Microelectronic Circuits and Systems kindly invites you to the presentation of new sensor developments to the booth of the Fraunhofer Group for Microelectronics. The booth-no is 170 in hall 2. The fair will take place in Munic from November 14 to 17 th 2023.
We will present:
Industrial and Medical Electronics
- LiDAR Camera Owl
- BioSPAD
- LiDAR Wafer
We offer R&D services, design, process development and prototyping for sensors and integrated systems. Our technology experts will be available to present our comprehensive process portfolio for development and fabrication of integrated electronic, optical and photonic components.
Our exhibits will showcase 200mm wafer processing such as:
- 3D integration via chip-to-wafer and wafer-to-wafer bonding
- MEMS devices with deep-RIE
- atomic layer deposition for various substrates and materials
- chip-scale vacuum packages
- glass wafer processing
We are looking forward to meeting you !
If you have any questions or would like to arrange a meeting please contact me (sigrid.van.kempen@ims.fraunhofer.de).