scia Systems GmbH

Clemens-Winkler-Str. 6c
Chemnitz,  09116

Germany
http://www.scia-systems.com
  • Booth: B2461


scia Systems - Equipped for Precision

scia Systems develops and manufactures equipment with complex plasma and ion beam technologies for ultra-precise surface processing. The systems are applicable for coating, etching and cleaning processes, especially for the MEMS, microelectronics and precision optics industries. Due to their flexible and modular design, the process equipment can be configured according to customer specific requirements, for research applications as well as high volume production in either a "cluster" or "inline" configuration.

Our wide range of processing technologies includes etching processes, like Ion Beam Trimming, Ion Beam Milling and Reactive Ion Etching as well as coating processes such as Ion Beam Sputtering, PECVD and Magnetron Sputtering.

 Products

  • scia Mill 200
    System for full surface ion beam etching and milling of substrates up to 200 mm. A typical application is the structuring of complex multilayers of various materials....

    • The scia Mill 200 is designed for structuring of complex multilayers of various materials. For an exact process control different end point detection systems can be equipped. With its fully reactive gas compatibility the system enables reactive etching processes with enhanced selectivity and rate. The flexible design of the scia Mill 200 allows to adapt it as single substrate version as well as in high volume production cluster layout with up to three process chambers and two cassette load locks. 

    Features & Benefits

    • Etching angle adjustment with tiltable and rotatable substrate holder
    • Excellent uniformity without shaper
    • Enhanced selectivity and rate with reactive gases

    Applications

    • Structuring of magnetic memory (MRAM) and sensors (GMR, TMR)
    • Milling of metals in MEMS production (Au, Ru, Ta, …)
    • Milling of multilayers from diversified metal and dielectric materials
    • RIBE or CAIBE of compound semiconductors (GaAs, GaN, InP, …)
    • Production of surface relief gratings (SRG)
    • Ion beam smoothing for reduction of microroughness
  • scia Magna 200
    The system is used for precision wafer coatings by deposition of metals and/or dielectric layers. Typical applications include piezoelectric layers, optical coatings and passivation layers....

    • The scia Magna 200 is used for precision wafer coatings by deposition of metals and/or dielectric layers. With its selectable sputter modes and arrangements the system can be configured according the customer requirements. In addition, the system is suitable for small scale R&D applications as well as for mass production, in cluster layout with software controlled automatic production.

    Features & Benefits

    • RF bias for conformity and stress control
    • Superior uniformity with rotatable substrate holder
    • Low substrate temperature with helium contacting and electrostatic chuck
    • High deposition rates with reactive sputtering in unipolar and bipolar mode

    Applications

    • Temperature compensation films for TC-SAW devices (SiO2)
    • Piezoelectric films with excellent and defined crystal orientation (AlN)
    • Optical high- and low-refractive coatings (SiO2, TiO2, HfO2, ZrO2, Nb2O5, Ta2O5)
    • Electrical insulating films (Si3N4, SiO2, Al2O3)
    • Co-sputtering of metals and alloys
  • scia Trim 200
    Ion beam trimming system for high precision surface trimming of wafers, without limitations in film and wafer materials. Typically used for frequency trimming in manufacturing of acousto-electrical devices and post-CMP processing....

    • The scia Trim 200 is used for high precision surface trimming of wafers, without limitations in film and wafer materials. Designed for high-volume production the system has a throughput and maintenance optimized layout with a semiconductor cassette handling robot that accommodates all standard wafer sizes. In addition, a cluster configuration with two process chambers and two cassette load locks is available.

    Features & Benefits

    • Significant yield improvement
    • High precision and high throughput for low production costs
    • No edge exclusion with electrostatic chuck
    • Sub-nanometer removal with zero base etch function

    Applications

    • Frequency trimming of bulk acoustic wave (BAW) or surface acoustic wave (SAW) filters
    • Thickness trimming of silicon on insulator (SOI), quartz, lithium tantalate (LT) or lithium niobate (LN) wafers
    • Film thickness error or step height correction in thin film head (TFH) manufacturing
    • Dimensional correction of MEMS structures

Categories

202 Other Equipment
  • Vacuum drying & out gassing Systems
    • 204 MEMS Equipment
  • Deep RIE etching; Dry Etching
    • 205 Nanotechnology Equipment and Tools
  • Equipment, Nanotechnology Tools
    • 207 Process Equipment
  • Coat; Develop; Resist Processing; Track Equipment
  • Deposition; Chemical Vapor (CVD); MOCVD; PECVD; LPCVD; ALD; REALD; MVD
  • Deposition; Physical Vapor (PVD); Sputtering; Evaporation Equipment
  • Etching; Stripping; Ashing - Dry and Wet Equipment
  • Ion; E-Beam Milling Etching Equipment
    • 400 Components, Parts & Accessories
  • Vacuum Systems Components & Accessories (optical monitors; Sputtering target fixtures; lubricants
    • 401 Sub-systems
  • Plasma Sources; Controls; Monitoring; Diagnosis

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