The CrackScan optical inspection system precisely detects and identifies tiny cracks inside a wafer. The high-speed line scan cameras reliably detect defects such as LLS, PID, or COP with the highest precision, even at maximum throughput rates.
The system is easy to integrate into existing fully automated production lines. CrackScan can be used either as a standalone system or combined in a cluster with other inspection processes like WafQScan and SpecGAGE3D. CrackScan can be supplemented with EdgeScan to detect defects like chippings and scratches on the wafer edge.