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M-O-T Mikro- und Oberflächentechnik GmbH

Krughütter Straße 93
Saarbrücken,  Saarland  D-66128

Germany
http://www.mot-semicon.com
  • Booth: B2666

M-O-T is the leader for customized wet chemical solutions

M-O-T develop processes, machines and turnkey solutions at the highest technical and technological level. Our aim is to provide superb customer satisfaction even for the most complex projects.

M-O-T delivers powerful, user-friendly and leading edge processes with superior production efficiency. These proprietary technology innovations are now readily available on a worldwide scale.

We constantly stay in touch with the latest industry research so that we can implement relevant innovations into our product line to meet stringent customer requirements.

Our goal is to continue to be an international technology leader in the future.


 Products

  • μCHEM
    he etching module μChem is a wet chemical process tool for all process steps needed in the MEMS-, Semicon-, Optic- and Solar Industry.The system is made of plastics (polypropylene (PP) white) to guarantees a maximal resistance against chemicals......

  • The etching module μChem is a sufficient wet chemical process tool for all wet chemical process steps needed in the MEMS-, Semicon-, Optic- and Solar Industry. Because of the flexible arrangement and build-up, the etching system μChem is the ideal tool either for industrial or R&D demands. The complete buildup of the system is made of plastics (polypropylene (PP) white) to guarantees a maximal resistance against chemical attacks either of acids or bases. Of course, customized solutions are available after clearing the technical details

    Applications: MEMS, CMOS, Sensor, PV, R&D or Production Type

    Chemicals: non-organic like Acids and Alkali, SC1, SC2, Piranha

    Main features:

    • Batch or Single Wafer Version available for Cleaning, Etching, Dissolving
    • Body material: PP white
    • Bath materials: PP, PVDF, PTFE
    • PP plumbing, optional PVDF or PFA tube with PFA Flaretek Fittings
  • μSRD
    Spin Rinse Dryer system for cleaning and drying wafers for all batch application ......

  • The MOT μSRD is an advanced Spin Rinse Dryer system developed by M-O-T GmbH. The μSRD is a wet process tool designed for cleaning and drying wafers for all batch applications. The standalone MOT μSRD is specially designed for easy operation and maintenance. A single cassette of wafers is placed in a stainless steel rotor. The complete buildup of the system is made of plastics (PP white) or stainless steel and guarantees therefore a maximal resistance against chemical attacks either of acids or bases.

    FEATURES

    • One chamber and double stack configurations
    • Process of Wafer Baskets (25 wafers)
    • High- or Low-Profile Cassettes
    • Easy programming of rinse, dry and purge steps
    • Balanced rotor with cassettes
    • Electro polished Chamber and Rotor
    • Easy exchange of Rotor

    OPTIONS

    • Chamber Ionization
    • DI-Reclaim
    • DI Heating System
    • Tool less exchangeable insert made of plastic
    • For running different wafer sizes
    • Resistivity Monitoring

    BUILD-UP

    • Material: PP white, Stainless Steel
    • Door material: PVC transparent
  • μGALV-W
    The advanced plating tool for all kind of plating applications can be delivered in three versions – for wafers (W), for quantum tech market (Q) and for panels (P)......

  • The electroforming unit μGalv-W is an advanced plating tool for all kind of plating applications in the MEMS-, Semicon-, Optic- und Solar Industry based on Wafer. Because of the flexible arrangement and build-up of the processes including process ramp-up, the electroforming unit μGalv-W is the ideal tool either  for industrial or R&D demands. Of course, customized solutions are available after clearing the technical details

    Applications: Contact pads, Redistribution Layer RDL, Pillar, TSV fill, MEMS, Wafer Chip Scale Package (WCSP), Quantum technologies

    Chemicals: acids or base electrolyte; sulphite base, alkaline base

    • Electroforming of metals like Ni, Cu, Au, Ag, In
    • Electroplating of alloy like NiFe, NiCo, NiW, SnPb …
    • Electro less plating of Ni, Au, SnPb …
    • Process cell build up possible as Rack Plater, Fountain tower or Flow Channel (tilted Wafer rotation)
    • Material: PP white
    • Pump: centrifugal pump made of PP, optional PVDF or PTFE
    • Filter: PP 20", optional PVDF/PFA
    • PP plumbing, optional PVDF or PFA tube with PFA Flaretek Fittings
  • μGALV-P
    The electroforming unit μGalv-P is an advanced plating tool for all kind of plating applications in the MEMS-, Semicon-, Optic- und Solar Industry based on panels......

  • The electroforming unit μGalv-P is an advanced plating tool for all kind of plating applications in the MEMS-, Semicon-, Optic- und Solar Industry based on Panel. Because of the flexible arrangement and build-up of the processes including process ramp-up, the electroforming unit μGalv-P is the ideal tool either  for industrial or R&D demands. Of course, customized solutions are available after clearing the technical details.

    PLATING MODULE

    • Panel Size: min 300 x 300 mm
    • Semi-Auto Handling
    • Overflow process consisting of a process cell and reserve tank with filtration circuit
    • Customized Chamber amount
    • Electroforming of metals like Ni, Cu, Au, Ag, In
    • Electroplating of alloy like NiFe, NiCo, NiW, SnPb …
    • Process cell build up as Rack Plater,
    • Pulse and Reverse Pulse Plating with minimum pulse time of 0.1 msec, optional complex wave forms like sinus, triangle etc.

    RINSING MODULE

    • Standard: Overflow Rinse,
    • Optional: QDR,

    General OPTIONS

    • Fully Automatic Handling (Semi Auto, Dry in – out)
    • Integration of pre/post process cells possible
    • Integration of Laminar-Flow-Units
    • Etching and Wetting Cells available
    • FM 4910 proofed material optional

    BUILD-UP

    • Material: PP white
    • Door material: PVC transparent
    • Pump: centrifugal pump made of PP, optional PVDF or PTFE
    • Filter: PP 20", optional PVDF/PFA
    • PP plumbing, optional PVDF or PFA tube with PFA Flaretek Fittings
    • HMI: IPC with Keyboard/Monitor
    • IPC with PLC Control
  • μGALV-Q
    Quantum technologies solution: Nb anodizing tool for fabricating Josephson junctions and superconducting quantum interference devices (SQUIDs)......

  • Wafer Sizes: up to 300mm

    Applications: fabricating Josephson junctions and superconducting quantum interference devices (SQUIDs) which is based on the local anodization of niobium strip lines

    Chemicals: acids or base electrolyte;

    Body material: PP

    Bath materials: PP, PVDF, PTFE

    Product Application: Wet Electrochemical Anodization

    Plating Circuits: 1 Process Circuit: 1x Anodization (Material: PP) Fountain plater

    Washing + Drying Step: 1x Hot-Wash and Drying Station (Material: PVDF) or IPA draying station (Material PP)

    Chemical Dosing: Make up and dosing station (2 liquid chemicals)

    Non-Uniformity: < 3% within wafer, measuring starting 5mm from substrate edge

    Wafer to wafer: < 2% wafer to wafer

  • μLAB
    Compact laboratory tool μLab is a sufficient is compact and modular set up for manual handling & automated photolithography processing. Such tool is required in the MEMS-, Semicon-, Optic- und Solar Industry.....

  • Compact laboratory tool μLab is a sufficient is compact and modular set up for manual handling & automated photolithography  processing. Such tool is required in the MEMS-, Semicon-, Optic- und Solar Industry. Because of the flexible arrangement and build-up, the laboratory tool μLab is the ideal tool either for industrial or R&D demands. It is able to integrate any different processing modules providing photoresist spin process, photoresist developing, spin cleaning and etching, HMDS vapour primer, hot plate and cold plates.

    PROCESSING MODULE

    • photoresists spin coater module, developer module, spin etching module, spin cleaning module with megasonic option;
    • hot plates and cold plates, hmds primer;
    • Customized process modules amount and Material Selection
    • PLC controlled
    • Touch Panel for easy operation

    RINSING MODULE

    • Sink and Overflow Rinse bath,
    • Optional: QDR, SRD

    General OPTIONS

    • Drying shelf, electrical sockets;
    • Integration of Laminar-Flow-Units
    • Execution as fume hood
    • FM 4910 proofed material

    BUILD-UP

    • Depend on process: SST or PP white
    • Door material: PVC transparent
    • PP plumbing, optional PVDF or PFA tube with PFA Flaretek Fittings
    • HMI: Touch Panel

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