Nanotec International GmbH

Kreuzhofstrasse 10
Muenchen,  D-81476

Germany
http://www.nanotec-gmbh.de
  • Booth: B2151

nanotec international GmbH supplies production-, test- and development products and technical services to the European Semiconductor and related industry with the main focus on the assembly- and test-side of semiconductor production. Products include Test Sockets for various package types and memory modules, Memory Module Tester, Mold Compound, Wire Bonding Tools and Accessories as well as Assembly and Test Equipment.

Categories

200 Packaging and Assembly Equipment
  • Ball Placement; Attach Systems
  • Cleaning; Washing Equipment for Assembly & Packaging
  • Cut & Down Set; Trim; Form Equipment
  • Deflashing; Degating Tools
  • Device Handling; Feeding Systems
  • Dicing; Sawing; Scribing; Separation Equipment
  • Die Bonding; Attach Equipment
  • Die Sorter; Pick & Place; Flip Chip Placement Systems
  • Lead Finishing; Straightening Equipment
  • Lead Frame Taping Systems
  • Marking; Imprinting; Labeling Equipment
  • Molding; Encapsulation; Decapsulation Equipment
  • Package Handling; Conveying Equipment
  • Solder Reflow; Soldering & Brazing Equipment
  • Wafer Level Bonders
  • Wafer Mount; Taping Equipment
    • 201 Flat Panel Display Equipment
  • Laser Treatment; Cutting Systems for Panels & Photocells
    • 202 Other Equipment
  • Cutting; Drilling; Laser ablation; Beveling Equipment
  • Heating; Annealing; Curing Equipment - Furnaces; Conveyors; Ovens; Test Chambers; Heat Treating
  • Repair; Rework Equipment
    • 203 Inspection & Measurement Products
  • Wire Bonding Inspection; Test
    • 206 PV Equipment
  • Inspection and Metrology
  • Integration and Automation
  • Modules
    • 207 Process Equipment
  • Bumping Systems
  • Wafer Identification; Marking Equipment
    • 208 Test Equipment
  • Burn-In Accessory Systems
  • Handlers; Positioner Systems
  • Probe Card Maintenance and Analysis Systems
  • Probing Equipment incl. Analytical; Circuit; Manual; E-Beam; Optical; Wafer Probers
    • 300 Packaging and Assembly Materials
  • Bonding; Interconnect Materials - Wire; Ribbon; Tape; Capillaries & Tools
  • Lead Frames & Headers: Etched; Stamped
  • Molding; Encapsulation; Potting; Resin Materials
  • Package Substrates; Laminate; Film based
  • Printing Masks; Screens
  • Solder; Solder Balls and other Soldering Materials
    • 304 Mask Making Materials
  • Mask and Reticle Handling Products
    • 308 Substrates
  • Silicon on Insulator (SOI); Silicon on Sapphire (SOS); Silicon Carbide;
    • 309 Test Materials
  • Burn-In Boards; Performance Boards (incl. Low; High Temp and Ceramic)
  • Probe Cards; DUT boards and other probing accessories (incl Ceramic and Special Purpose Probe Cards)
  • Test Sockets; Contactors and Contact accessories
    • 400 Components, Parts & Accessories
  • Chucks for Wafer and other Substrates
  • Connectors; Plugs; Interconnects; Cable; Wire
    • 401 Sub-systems
  • Temperature Sensing; Control; Recirculators; Chillers; Heat Exchangers
    • 502 Material Handling Systems
  • Conveying; Material Handling Systems
  • Robotics; Transfer Systems
  • Stockers; Storage, AMHS
    • 804 Professional Services
  • Sales; Manufacturers Representation or Distributors

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