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Advance your semiconductor fabrication and characterisation processes with Oxford Instruments’ full spectrum of solutions. Visualise component distribution, material stress and strain, and crystallinity in 3D with Raman imaging microscopy; characterise defects, roughness, elasticity and electronic properties using Atomic Force Microscopy (AFM); evaluate structure and elemental composition with the electron microscopy techniques: EDS, EBSD, and the revolutionary BEX (Backscattered Electron and X-Ray); and achieve precise and consistent etch, deposition and growth of micro- & nano-structures and films using atomic layer etch, atomic layer deposition, ICP (etch & dep), PECVD and Plasma Polish Dry Etch for SiC processing with our plasma technology solutions.