Liebigstrasse 8
Kirchheim b. Muenchen,  D-85551

  • Booth: B1201

DISCO is a total solution provider for advanced Dicing (Kiru), Grinding (Kezuru) and Polishing (Migaku) technologies. 

- Wafer dicing by blade, ablation laser, stealth laser and plasma

- Wafer thinning by grinding and stress relief (Dry Polishing, CMP and Plasma Etching)

- Various laser processes (Laser grooving, Laser Lift-Off, LEAF, via hole, curvilinear process, etc.)

- SiC solutions (Ingot slicing by KABRA, new dicing method for SiC with back side metallization)

- Unique solutions such as TAIKO, Dicing Before Grinding and more

- Surface planarization

- Dicing tape and Grinding tape

- Tape mounter / peeler

- Expander / Die separator

- Camtek AOI (Automatic Optical Inspection)

- Dicing-Grinding Service and Camtek optical inspection service in our cleanroom at Munich office. Please also visit https://www.dicing-grinding.com/

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