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TDM Systems by Insidix offer state of the art deformation and warpage measurement, while devices under evaluation are experiencing thermal stress.
The technology uses Phase Shifting Projection Moiré, advanced 3D sensors, and in-situ temperature chambers, able to apply temperatures between -65°C to 400°C.
The systems are ideal for research development, quality and reliability, process development, and failure analysis studies.
They meet and surpass all deformation measurement standards for temperature cycling, moisture/reflow, coplanarity testing, warpage test methods, among others.
Advancements in 3D analysis and Projection Moiré have evolved into nanoscale detectability and sample sizes of max. 600x800mm.
Present in Semiconductor, Medical, Automotive, Aerospace, and Electronics industries