QC-Quality Control GmbH

Dieselstrasse 11
Karlsfeld,  D-85757

Germany
http://www.qc-quality-control.de
  • Booth: B0800

Our business is to improve your business

QC-Quality Control GmbH represents:

- RION Inc. Ltd., Japan / MGN International, Inc., USA - Particle Counter for Air, UPW, Chemicals and Gases;

- Corning Laser Technologies GmbH, Germany - Scribe & Scribe System, 

- Millice Pte Ltd, Singapore - Dicing Materials and Consumables (WaferGrip, Mylar); 

- AiTechnology Inc., USA - Die Attach Adhesives, Thermal Interface Materials, Tapes & Waxes, Underfill, Advanced Flexible Polymer a.o.

- DESCO Industries Inc., USA -  Static Control & Cleanroom Products, Antistatic Tapes, ESD Test Instruments 

- Ionizers from SIMCO ION 

- Kanomax FMT - USA - Nanoparticle Measurement Solutions

Categories

200 Packaging and Assembly Equipment
  • Backgrind; Slicing; Lapping; Polishing Equipment
  • Cleaning; Washing Equipment for Assembly & Packaging
  • Dicing; Sawing; Scribing; Separation Equipment
  • Die Bonding; Attach Equipment
  • Dispensing Systems
  • Wafer Level Bonders
  • Wafer Mount; Taping Equipment
  • Wire Bonding Equipment
    • 201 Flat Panel Display Equipment
  • Scribe and Break Equipment
    • 202 Other Equipment
  • Heating; Annealing; Curing Equipment - Furnaces; Conveyors; Ovens; Test Chambers; Heat Treating
  • Lamination; Sheet Laminating Equipment
    • 203 Inspection & Measurement Products
  • Defect; Particle; Bump; Contamination Detection, Review or Inspection
  • Die Inspection; Die Shear
  • Fiber Optic Inspection Instruments
  • Film Thickness; Thickness; Uniformity Measurement; Ellipsometer
  • Particle Monitors; Analyzers - Airborne or Liquid
  • Wire Bonding Inspection; Test
    • 204 MEMS Equipment
  • Deep RIE etching; Dry Etching
  • Wafer Level Bonders
    • 206 PV Equipment
  • Thin Film
    • 207 Process Equipment
  • SOI Bonders; Temporary Bonders; De-Bonders
    • 208 Test Equipment
  • ESD; EMS and Latch-up Systems
    • 300 Packaging and Assembly Materials
  • Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive
  • Bonding; Interconnect Materials - Wire; Ribbon; Tape; Capillaries & Tools
  • Scribe Tools; Saw or Dicing Blades and Accessories
  • Tape Automated Bonding (TAB) Accessories
  • Thermal Interface Materials; Heat Sinks
  • Thick Film Pastes; Materials
  • Thin Film; Dielectric Film Materials
    • 301 Chemicals & Solids
  • Other Specialty Chemicals
  • Surface protection material; coatings
    • 306 PV Materials
  • Solar Glass, encapsulation
    • 400 Components, Parts & Accessories
  • Sealants; Adhesives; Finishes
    • 500 Factory Monitoring & Control Systems (FMCS)
  • Chemical; Pure Water; Fluid Handling; Storage; Supply Systems
  • Chemical; Pure Water; Fluid Monitoring & Control Systems
  • Environmental; Utility Systems & Monitoring
    • 501 HVAC, Temperature, Humidity, Contamination Control
  • Clean Rooms
  • Contamination Control; HEPA Filtering Systems
  • HVAC; Temperature; Humidity Systems and Control
    • 502 Material Handling Systems
  • Static; ESD Control
    • 701 Manufacturing Services or Consulting
  • Clean Room; Contamination Control
  • Static; ESD Testing & Control Services
    • 900 Support Products
  • Analytical Standards; Calibrators
    • 901 Printed, Organic, Flexible and Large Area
  • Materials: Consumables

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