DELO Industrie Klebstoffe

DELO-Allee 1
Windach,  86949

Germany
  • Booth: B2467


Innovative adhesives for semiconductor manufacturing.

DELO is a leading manufacturer of high-tech adhesives and other multifunctional materials as well as dispensing and curing technology. Its products are mainly used in the automotive, consumer electronics, and semiconductor industries. They can be found in almost every mobile phone and in most cars worldwide, e.g., in cameras, loudspeakers, electric motors, or sensors. Our semiconductor adhesives are developed to bond and encapsulate bare silicon dies, packages and SMT components and to optimize performance of the final application. We provide a wide range of reinforcement, die attach and encapsulation solutions as well as adhesives for the airtight-sealing of sensor packages that also improve reliability. With our international offices, we are represented worldwide – we are where you are!

 Press Releases

  • Windach, October 11, 2023 | DELO has developed a flexible electronics adhesive that permanently seals sensor housings airtight and thus reliably protects components such as image sensors. DELO DUALBOND BS3770 meets the stringent requirements of the semiconductor and automotive industries and helps drive innovation in autonomous driving.

    The autonomous driving trend comes with ever-stricter safety requirements. Therefore, reliable components such as image sensors are installed in LiDAR and RADAR systems. Sensor housings on PCBs must be hermetically sealed throughout their entire service life in order to maintain their function permanently without interruption. However, previous solutions for hermetically sealing the housing and filter glass are reaching their limits due to these stricter requirements, failing to withstand the tests of the automotive industry, according to standard AEC-Q100.

    DELO has developed DELO DUALBOND BS3770, a special electronics adhesive for semiconductor manufacturers to meet the demanding reliability and qualification tests of automotive suppliers.

    Unlike adhesives previously available on the market, the newly developed adhesive is a flexible product with a Young's modulus of less than 5 MPa at room temperature. Due to its flexible properties starting from a temperature as low as approximately -50 °C, the adhesive can compensate for pressure changes that occur, such as those caused by temperature changes, humidity differences, or heat input in the reflow process during production. As a result, defects such as pop-ups or delamination do not occur, and the sensor is permanently protected.

    DELO DUALBOND BS3770 can be precisely applied by needle dispensing while maintaining narrow and high bondlines. Curing takes place in two consecutive steps using UV light and heat. After dispensing, the adhesive is fixed in a few seconds by means of classic light fixation. Alternatively, it can be transferred to the B-stage, which is particularly relevant for bonding filter glasses with blackprint. At this stage, it achieves an initial adhesion comparable to tape. Afterwards, the second component can be joined. Thanks to the adhesive’s initial adhesion, the component is directly fixed so that it can be entirely processed further. Final curing takes place in a convection oven at +150 °C within 40 minutes.

    In addition to image sensors for LiDAR and RADAR applications, DELO DUALBOND BS3770 is also used in driver monitoring and for 5G applications.

    This new adhesive and other high-tech solutions for the semiconductor industry will be presented by DELO at SEMICON Europe (Booth B2467), which will be held in Munich on Nov. 14-17, 2023.

 Products

  • DELO KATIOBOND and DELO MONOPOX adhesives
    DELO provides numerous high-tech adhesives for assembly, microelectronics and semiconductor applications....

    • DELO develops tailored functional materials optimized for different applications such as die attach, underfill, cap bonding and encapsulation. These materials are used to bond individual components, protect components, reinforce solder joints (e.g., via processes like Edge Bond or Cornerfill), and to produce precise 3D structures. They are also used in sensor applications such as MEMS sensors. DELO materials are optimally suited for fully automated series production. They can be applied by screen and stencil printing, as well as jetting.
  • DELO DUALBOND BS3770
    This adhesive gives sensor housings a permanent airtight seal, thus reliably protecting components such as image sensors....

    • DELO DUALBOND helps drive innovation in autonomous driving while meeting the stringent requirements of the semicon and automotive industries. Unlike adhesives previously available on the market, this adhesive is flexible with a Young's modulus of less than 5 MPa at room temperature. Due to these flexible properties, starting from a temperature as low as -50°C, it can compensate for pressure changes that occur, such as those caused by changes in temperature, humidity differences, or heat input in the reflow process during production. As a result, defects such as pop-ups or delamination do not occur, and the sensor is permanently protected. DELO DUALBOND BS3770 can be precisely applied by needle dispensing while maintaining narrow and high bondlines. Curing takes place in two consecutive steps using UV light and heat. 
  • DELOLUX 20, 202
    DELOLUX area lamps offer...

    • DELOLUX 20 and DELOLUX 202 are compact, high intensity curing lamps, with improved energy efficiency, and available with intensities up to 1,200 mW/cm² or 600 mW/cm². High intensities of 1,200 mW/cm² are ideal for applications where a layer of adhesive needs to be cured quickly between two components that are difficult to irradiate, or where the joined materials are located slightly further away from the light source due to design limitations. The adhesive can be cured within seconds while retaining a dry surface. In addition to area lamps, DELO also provides its customers with powerful spotlight and line lamps.
  • DELO-DOT PN5
    The high-performance DELO-DOT PN5 microdispensing valve impresses with its wide range of applications and easy, tool-free maintenance of the fluid system. Its compact design allows for easy integration into production systems....

    • DELO-DOT PN5 is a pneumatic jet valve that can reproduce dispensing results at a continuous frequency of up to 300 Hz, even on difficult media. It allows for contactless application, preventing collisions between the dispensing valve and the component. Even high-viscosity materials can be dispensed accurately, precisely, and reliably. The valve offers interchangeable nozzles with different diameters, as well as a flexible adjustable plunger stroke. This ensures that the application is reproducible using drop sizes of varying nanoliters. With its dimensions of 68 mm x 28 mm x 99.5 mm (W x D x H), DELO-DOT PN5 can be integrated into process systems to save space. The jet valve’s cartridge retainer, which can be positioned in 90° increments, allows media to be fed from all four sides of the device. This further simplifies integration into production systems. 
  • DELO KATIOBOND OM6611
    The material is made for the replication of lenses or nanostructures. Due to its exceptional optical and mechanical properties, this material makes a superb candidate for fabricating optical elements with the best possible quality....

    • DELO KATIOBOND OM6611 is a fast-curing epoxy-based polymer which can be utilized universally for molding single lenses or micro-lens arrays (MLA), as well as to replicate nanostructured diffractive optical elements (DOE), e.g., using EVG’s SmartNIL® technology. It exhibits minimal stamp interaction and low detachment force with most typical stamp materials, which enables long stamp life and automated separation. A demonstrably low-volume shrinkage of only 2.4% allows for replication of master geometries and smooth optical surfaces in the lens molding process. DELO KATIOBOND OM6611 shows high transmission values close to 100% over the entire visible spectral range with no scattering, thus making it perfectly optically clear. Its excellent optical stability  is maintained, even after the most challenging reliability tests (e.g., 3x reflow test according to JEDEC standard J-STD-020D). 

Categories

200 Packaging and Assembly Equipment
  • Dispensing Systems
    • 300 Packaging and Assembly Materials
  • Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive
  • Molding; Encapsulation; Potting; Resin Materials
    • 400 Components, Parts & Accessories
  • Lamps (non Lithography), all type UV; LED and other
  • Sealants; Adhesives; Finishes
    • 901 Printed, Organic, Flexible and Large Area
  • Equipment: Curing
  • Materials: Inks, pastes, printing
    • 904 Electronic Applications
  • Healthcare: sensors
  • Imaging: Camera and Camera Modules
  • Imaging: CCD, CMOS and organic sensors
  • Lighting: LED
  • Security: Identification

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