Carl Zeiss Microscopy

Carl-Zeiss-Strasse 22
Oberkochen,  D-73447

Germany
http://www.zeiss.de/microscopy
  • Booth: B0708

Welcome at ZEISS Booth in Hall B0, explore ZEISS solutions

ZEISS provides the most comprehensive microscopy portfolio in the electronics and semiconductor industries, with superior imaging and optimized workflows to meet productivity needs for R&D, production, and failure analysis.

Categories

203 Inspection & Measurement Products
  • Defect; Particle; Bump; Contamination Detection, Review or Inspection
  • Die Inspection; Die Shear
  • Microscopes: Atomic Force Microscopes (AFM)
  • Microscopes: Confocal Scanning Microscope; 3-D Video Microscopes
  • Microscopes: Optical Microscopes
  • Microscopes: SEM; Focused Ion Beam (FIB), TEM
  • Overlay Measurement
  • Package Inspection; Lead Scanners
  • Particle Monitors; Analyzers - Airborne or Liquid
  • Spectrometers; FTIR; ATR-FTIR; Auger Electron (AES); SIMS
  • Wafer; Substrate Metrology; Topology; Nanotopography; Flatness Measurement; Crystalline Orientation
  • Wire Bonding Inspection; Test
  • X-ray; XRF; 3-D X-Ray; LEXES Systems
    • 205 Nanotechnology Equipment and Tools
  • Equipment, Nanotechnology Tools
    • 207 Process Equipment
  • Ion; E-Beam Milling Etching Equipment
  • Lithography; Exposure; Aligners; Direct Write Systems; Steppers; Scanners; Nanoimprint
    • 208 Test Equipment
  • Circuit Repair; Design Modification; Redundant Memory Repair; Mask Repair Systems
  • Failure Analysis Systems
  • Functional Test Systems
  • Probing Equipment incl. Analytical; Circuit; Manual; E-Beam; Optical; Wafer Probers
    • 603 Simulation, Analysis; Modeling Software
  • Simulation; Characterization; Verification Software
    • 700 Manufacturing Services
  • Measurement; Inspection Service
    • 701 Manufacturing Services or Consulting
  • Product Development; Software Design; Product Lifecycle Management
  • Software Programming; Software Development
    • 904 Electronic Applications
  • Imaging: Image Processing, Software and System
  • Imaging: Optics and Micromechanic

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