Lothringer Allee 2
Bochum,  44805

  • Booth: B1804

Welcome to the future of wafer dicing. #LiterallyCuttingEdge

LIDROTEC - the finest cuts on every wafer, "literally cutting edge".

Here at LIDROTEC, we stand for quality, innovation and precision. We build laser dicing machines to cut microchips for the semiconductor industry. Our technology reduces the damage rate in the cutting process to virtually 0% (current waste rate is up to 10%). Our unique innovation is the use of liquids to cool and rinse the wafers while they are cut with the laser. Semiconductor manufacturers that use our cutting-edge technology will save costs and increase both productivity and their sales potential.     

 Press Releases

  • Title: Warum der Chipriese Intel an das Bochumer Start-up Lidrotec glaubt

    Date: 15 December 2021

    Link: https://www.handelsblatt.com/technik/it-internet/lasertechnik-warum-der-chipriese-intel-an-das-bochumer-start-up-lidrotec-glaubt/27854924.html


  • LidroCUT® laser dicing machine
    The LidroCUT® laser dicing machine reduces the damage rate in the cutting process to virtually 0%. No micro cracks, no chipping, no heat damages and no debris on the surface....

  • LIDROTEC cuts microchips more efficiently than any other current technology. The unique innovation of our machine is the combination of a laser with liquids. The liquids cool and rinse the material while it is being cut with an ultrashort-pulse (USP) laser. Minimum induction of heat as well as the rinsing of debris enable microchip production with no micro cracks, no chipping and no debris on the surface. Hence, the rate of damaged microchips during the dicing process is reduced to virtually 0%. This saves material costs and increase profitability for semiconductor producers. Additionally, valuable resources that are used to build microchips, such as rare earths or gold, can be saved, helping with the conservation of resources.

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