Comet Yxlon GmbH

CA20 – The fastest way from R&D to ROI

The semiconductor sector is a speed-driven industry. In the race for innovation every day counts. As an inspection system specifically developed for the challenges of complex 3D ICs in Advanced Packaging, the CA20 helps you keep the pace – and to stay ahead of the game. The CA20 enables an accelerated verification of new packaging process node prototypes: The faster you find the root cause of ramp-up issues and fix them, the faster you’ll reach the desired yield – and, thus, the Return-on-Invest (ROI).

CA20 highlights

• Designed for the semiconductor industry
• Non-destructive technology for three-dimensional insights into solder bumps within minutes
• Repeatable results through reliable and accurate technology, designed to support a stable inspection routine
• Efficient software-assisted review including automated void analysis with Void Insights
• Dose Manager for the protection of X-ray sensitive components

Our innovative software solutions 

• The CoS 3D Clarity package as part of our award-winning Geminy software is your tool to quickly create high resolution 3D images.
• Use our Batch Manager to inspect trays of ICs or substrate strips with a few clicks.
• Protect your sensitive inspection parts from critical X-ray doses with the Dose Manager.

SMT inspections: grand performance for small devices

Due to the continuous miniaturization of electronic components, more and more features must fit in an ever-smaller area. For the most accurate and repeatable quality inspection results, a test system must not only provide high performance and resolution but also needs to be equipped with dynamic image enhancement filters. The Comet Yxlon Cheetah EVO features:

Large flat-panel detectors with up to 50% larger field of view for a better overview and faster working processes due to reduced steps in automated processes

Best laminography with micro3Dslice, with detailed 3D visualization for quick and easy failure analysis – resulting in substantial cost-savings compared to micro sectioning

Automatic void calculation with VoidInspect CL or DR, the laminography- or radiscopy-based inspection workflows enabling the rapid non-destructive analysis of voids inside the solder joints of board components

THTInspect DR, the semi-automated defect analysis for fill level inspections on THT-based components in 2D

Integration in the production line: ProLoop (Link auf Video weiter unten) allows direct communication with inline AOI / AXI inspection systems

Optional high load capacity (< 20 kg) with reinforced table and mechanics: Several parts and electronic interconnects in fixed packages can be inspected at once – a real-time saver

Cheetah EVO highlights

• Reliable, fast, and repeatable inspections – manually and automatically
• Automatic void calculation with VoidInspect
• Easy-to-use, dynamic enhancing filters, e.g., eHDR
• Best available laminography with micro3Dslice and FF CT software
• Dose reduction kit, dose monitoring, and low dose detector mode for sensitive components
• Optional new water-cooled X-ray tube for a stable focal spot
• Optional high load capacity (< 20 kg)

The optional water-cooled FXT 160.51 X-ray tube

Inspectors know the problem: long scan times often lead to image distortions and question test repeatability due to labile results. It's an effect caused by the rising temperature of the tube housing and the target, which can lead to focal spot drift. The new water-cooled X-ray tube counteracts this phenomenon. It provides reliable heat dissipation and ensures a stable focal spot and crystal-clear X-ray images even after long beam times. You achieve reliable inspection results for the first scan just as for the umpteenth and can rely on the repeatability of the X-ray inspection at any time.