OEG GmbH

• Home
• Products

The company OEG GmbH was founded in 1991 and deals with the development and production of high-precision automatic optical measuring systems for industry and research. OEG GmbH focuses on measuring systems for optical, geometric and physical parameters. We are proud that OEG devices are now installed on all continents. This fact proves the efficiency and innovative strength of the OEG engineers and technicians. In addition to other branches of industry, OEG GmbH has numerous customers in semiconductor technology. The core product is the fully automatic contact angle measuring device SURFTENS WH 300. With a wafer robot, load port, SECS/GEM interface and a fully automatic measurement process, it meets all the requirements for use in highly automated wafer fabs. With our new development, an additional module for the SURFTENS WH 300 contact angle measuring device for EBR measurement, we are setting a new standard. We offer two measuring functions in one device! This saves investment costs and expensive clean room space. Other products for research and development in the semiconductor sector, such as a wafer stress measuring device and a precision wafer scriber device, round off our product portfolio.

Contact Angle Measuring System SURFTENS WH 300

The SURFTENS WH 300 contact angle meter serves for the measurement of contact angle and surface free energy (SFE) in semiconductor technology and provides the complete functionality, which is required in 300mm wafer fab´s.... More Info Less Info







Physical background

Surface tension of photolithographic materials like resist and developer has a great potential for the photolithographic process itself. For instance, homogeneity of spin coatings, planarization, and adhesion depend directly on surface tension of the materials involved. The SURFTENS WH 300 contact angle meter serves for the measurement of contact angle and surface free energy (SFE) in semiconductor technology and provides the complete functionality, which is required in 300mm wafer fab´s. This makes the device unique worldwide.

Main features of SURFTENS WH 300

-3 axis wafer handling robot

-load port for 12”-Wafer FOUP

-SECS / GEM interface

-optional bridge tool for 200mm FOUP

-video system for automatic drop shape analysis

-wafer scanner

-centring & notching before measurement

-automatic, software-controlled dosing system

-tank for main dosing system (DI water)

-automatic, software-controlled refill of main dosing system

-optional second dosing system for other test liquids

-filter fan unit

-optional hotplate for evaporating of water drops

-optional additional optical sensor for EBR measurement

- single cable connection to the main power distribution unit of the instrument

- EMO is integrated

Technical data for contact angle and SFE measurement

- sample size: 12” Si-Wafer

- on request: bridge tool for 8” Si-Wafers

- Position accuracy ± 0.05 mm in the sample level

- Range of contact angle measurement: 10° … 170°

- ± 0.5° measuring accuracy of the video system

- Range of SFE measurement: 0,01 … 2000 mN/m; resolution: min. 0.05 mN/m

Link to product video: https://www.oeggmbh.com/?p=12&k=6&kj=&z=&l=1



Precision Wafer Scriber MR200

The Precision Diamond Scriber MR 200 is used for manual scribing for the precise breaking of structured silicon wafers. MR 200 is the ideal tool for SEM preparations in semiconductor technology. ... More Info Less Info







Features

-electro-magnetic set down of the scribing diamond by foot switch

-high quality zoom microscope with stepless adjustment of magnification

-eye piece with hair cross for exact positioning of specimen to edges, structures, reference marks etc.

-manual x/y-table with rough-/fine positioning, (200 x 200) mm stroke

-200mm vacuum wafer chuck (100mm on inquiry) Teflon coated, mounted on x/y-table

--Vacuum hole (4 x 18) mm, other sizes or pattern are possible on request

-200mm digital gauge, readout 10 micron

-scribing diamond tip

-LED ring light with controller and power supply

Technical parameters

-fine positioning of x/y-table by micrometer screw for exact alignment of reference marks to scribing line

--25mm in x (transverse to scribing direction)

--200mm digital gauge, readout 10micron (transverse to scribing direction)

--10mm in y (in scribing direction)

-angle fine adjustment of wafer chuck by micrometer screw (10µm resolution = 0,006°)

-manually x/y-table, stroke (200 x 200) mm

-defined 90°-rotation of wafer-chuck without vacuum switch-off for exact 90°-scribing

-adjustable stops for 90°-rotation

-adjustable work angle for scribing diamond

-set down of scribing diamond by foot switch

-adjustable lowering speed of scribing diamond

-adjustable scribing power (10g....120g, others on inquiry)

-adjustable height of scribing diamond for different specimen thicknesses

-microscope features

--Microscope magnification 8x ... 40x

--resolution of optics better 10µm at magnification 40x

-materials: Silicon, all monocrystalline materials

-smallest specimen size: (5 x 5) mm

-dimensions: appr.  (430 x 700 x 550) mm (B x T x H)

-weight appr. 16kg

Optional attachments

-optical components for camera adaption

-color-video system with camera and software

-vacuum pump

-special scribing diamond tips

-pliers for wafer breaking

-Computer or Laptop with Windows OS



Contact Angle Measuring Instrument SURFTENS HL

SURFTENS HL 200 has been specially designed for use in process control in the surface treatment of Si wafers. SURFTENS HL 200 meet the needs for a fast, highly accurate and comfortable measurement of the wettability of silicon wafers.... More Info Less Info







Surface tension of photolithographic materials like resist and developer has a great potential for the photolithographic process itself. For instance, homogeneity of spin coatings, planarization, and adhesion depend directly on surface tension of the materials involved. The same applies to the surface free energy (SFE) of coatings.

Surface free energy (SFE) of substrates and layers, used in semiconductor technology can be investigated by contact angle measurement. Measuring the contact angle allows you to quickly optimize new process steps as well as to better standardize known processes. Small changes in the surface property of wafers are seen as large, easily detected changes in the contact angle. A small investment of time to measure the contact angle, can give a large return by avoiding later production problems. To reduce defect density and feature sizes of resist structures (<1μm), a good adhesion of the resist is necessary. By the help of contact angle measurement, you can control the adhesion very easily.

The contact angle measuring system SURFTENS HL 200 has been specially designed for use in the semiconductor industry and research, especially for process control in the surface treatment of Si wafers. It is the ideal tool, to investigate contact angle and wettability of wafers. SURFTENS HL 200 meet the needs for a fast, highly accurate and comfortable measurement of the wettability of silicon wafers.



Thin Film Stress Measurement System FLATSCAN

FLATSCAN is used for non-contact measurement of flatness, surface curvature, average radius and thin film voltage (wafer voltage) of all types of reflective surfaces such as silicon wafers and surface mirrors, metal surfaces or polished plastics.... More Info Less Info







Optical measuring principle for surface form measurement
FLATSCAN is used for non-contact measurement of flatness, surface curvature, average radius and thin film stress (wafer stress) of all types of reflective surfaces such as silicon wafers and surface mirrors, metal surfaces or polished plastics.

Technical Parameters
Reproducibility surface curvature (P-V) ≤ 100nm
Resolution of optical measuring system 0,1 arcsec
Accuracy of optical measuring system 1 arcsec
Measuring speed 10mm...30mm / sec
Measuring field Standard: ∅ 8”mm
Optional Measuring field: ∅ 12”



EBR Measuring System

The EBR measuring system is an optional module for the SURFTENS WH 300 contact angle measuring system and serves for the analysis and measurement of the Edge-Bead Removal (EBR). ... More Info Less Info







SURFTENS WH 300 – two measuring functions in one device

The application of photoresist, anti-reflective or polyimide coating to microelectronic substrates by spin coating often leads to the formation of so-called edge beads. This is the unwanted buildup of the coated material on the outer edges of the substrate in the form of a bump. These buildups can also wrap around the edge of the substrate, thereby contaminating the edges of the back side of the substrate as well. Since this can lead to problems during further wafer processing, these “bumps” are removed using special methods and equipment. 

The SURFTENS WH is a contact angle measuring system specially designed for the semiconductor technology. It offers fully automatic measurement of the contact angle of silicon wafers and is equipped with a load port, a wafer robot and a SECS/GEM interface.

Optionally, the device can be additionally equipped with a measuring and analysis system for edge bead removal.

This means that SURFTENS WH 300 offers the possibility of combining two measurement functions in a single device, which previously required two devices. Lower investment and less space required in the clean room therefore pay off immediately for the customer.

Analysis and measurement of the Edge-Bead Removal (EBR)

The additional module consists of a special camera with lighting so that the edge area of ​​the wafer can be optically recorded (see image below). The software of the additional module has an image processing system for fully automatic measurement of the width of the material-free edge area of ​​the wafer. The analysis of the edge area is carried out automatically over the entire circumference of the wafer. The width of the free area is also measured in freely selectable azimuths.

Technical data for EBR Measurement

Sample size (standard)	12” Si-Wafer
Sample size (optional)	8” Si-Wafer
Positioning accuracy of sample	± 0.05 mm (0,019685 inch)
Field of view of measuring system	6,14 x 4,93mm (0,2417323 x 0,1940945) inch
Resolution of measuring system	<1 micron
Accuracy of measurement	<5micron