Semiconductor ultrasonic welding/testing equipmentApplied to: DBC board, module welding integrated needle, header, fisheye needle, IGBT, SiC power module terminal welding, (copper and aluminum wire) automotive electronics, battery welding, etc.;
At the same time, it has the following capabilities: IGBT module delamination, semiconductor chip packaging delamination, diamond thickness measurement and internal defects, water-cooled heat sink welding defects and other detection