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Ulvac GmbH

Klausnerring 4
Kirchheim b. München,  D-85551

Germany
http://www.ulvac.eu
  • Booth: C1453


ULVAC, solution Provider for Deposition/Etching/Ashing/Impl.

ULVAC GmbH was established in 1987 as the European subsidiary of ULVAC, Inc. Headquartered in Munich, Germany. From Munich our sales and service team serve EMEA region. ULVAC provides a very broad portfolio of manufacturing equipment for the vacuum, materials, and thin film industries. ULVAC’s solutions diversely incorporate equipment, materials, analysis, and services for semiconductors, MEMS, flat panel displays, electronic components, PCB, TFB. ULVAC delivers all types of vacuum products such as vacuum pumps and measurement and analysis equipment.

ULVAC offers state-of-art products and technologies for semiconductor and related processes. To support MEMS, power devices, NVM fabrication ULVAC offers a line of sputtering, evaporation, plasma etch, ashing equipment, ion implanting, oxidation/POA/Nitridization, and activation annealing for both R&D and manufacturing.

ULVAC has developed systems dedicated to advanced processing for thin film, lithium-ion battery manufacturing. This equipment range includes discrete (single) substrate battery fabrication for sputtering and evaporation.

Come by our booth and discuss your processing needs with our sales professionals.


 Products

  • Entron-EX
    PVD Solutions for 300 mm Wafers ...

  • The ULVAC Entron EX system offers you a single to tandem core platform, high performance and of course high reliability for special PVD solutions.

    High productivity coupled with high space efficiency are of course just as obvious as a

    small footprint and make our Entron-EX an exceptionally effective system in the field of PVD solutions.

    See ULVAC at our booth in Hall C1, 453. 

  • Enviro Optima
    Replace Your Old Legacy Ashing Systems...

  • The production proven ULVAC Enviro Optima resist strip system replaces up to 6 legacy ashing tools. It provides the highest throughput per square meter of clean-room space at the lowest CoO. At >12µm/min ashing rate and 245 WPH, Optima utilizes the latest ashing technology featuring a remote ICP plasma source for ultra-high throughput. The system is configurable for 100mm – 300mm wafers. The Enviro Optima is ideal for all resist strip work including difficult to strip resists, like SU-8, residue removal, and surface preparation applications. See ULVAC at our booth in Hall C1, 453. ULVAC, your Solution Provider for Deposition, Etching, Ashing and Implantation.

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