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ELEMENT 3-5 GmbH

Robert-Koch Strasse 6A
Baesweiler,  Robert-Koch-Str. 6a  D-52499

Germany
http://www.element3-5.com
  • Booth: C2507


Nothing less than a semiconductor revolution!

ELEMENT 3-5 GmbH

ELEMENT 3—5 [Element three to five] - based in Baesweiler, Germany – is a technology source for the semiconductor industry. The product spectrum ranges from production systems based on the novel low-temperature epitaxy to powerful ion and plasma sources for wafer cleaning and surface activation.

Our innovative high-performance system - ACCELERATOR 3500K - enables production of monocrystalline aluminum nitride templates at 10-fold higher capacity, increased layer homogeneity and with significantly lower production costs compared to conventional MOCVD systems

Producers of Wide Bandgap power electronics or LED devices appreciate the significant productivity increases and capacity expansions offered by the ACCELERATOR 3500K.

The powerful ICP sources of ELEMENT 3-5 GmbH are mainly used in the field of wafer cleaning and surface activation. Their characteristics are high efficiency at high plasma densities paired with uniform distribution over large areas and volumes.

System solutions for material systems such as AlScN, GaN and SiC for large wafers will follow in 2024.

www.element3-5.com


 Products

  • ACCELERATOR 3500K
    ELEMENT 3-5's ACCELERATOR 3500K is an innovative epitaxy system designed for the mass production of aluminum nitride (AlN) epitaxial thin films....

  • The ACCELERATOR 3500K utilizes ELEMENT 3-5's patented Next Level Epitaxy (NLE) technology. which combines plasma sources and ion guns to achieve single crystal AlN layer growth at low temperature. 

    The system offers signifdicant advantages in epi quality, production capacity and efficiency compared to conventional methods: 

    • single-crystal quality AlN layers at temperatures below 300°C
    • modular design with in-line concept
    • Accomodates 35x300mm, 70x200mm, 135 x 150mm or 300x100 wafer per processing cycle
    • provides a tenfold increase in capacity
    • enables 90% energy savings in AlN thin film epitaxy production
    • significantly reduces CO2 footprint
    • over 80% material incorporation efficiency
    • significant reduction of gas and consumable costs
    • lowers total manufacturing costs for LED, HEMT, and other wide bandgap semiconductor applications

    The System is designed to help manufacturers enter new markets like micro-LED for displays or expand mature markets such as GaN on Sapphire or GaN on Si (HEMT) applications without investment in additional MOCVD equipments.


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