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Nextool Technology Co.,Ltd

No.2888 North Tian MenShan Road
Economic & Technology Development Zone
TongLing,  Anhui Province  244000

China
http://www.nextooling.com
  • Booth: C2609


Creating more value for you!

NEXTOOL TECHNOLOGY CO., LTD was founded in 2005 with registered capital of RMB 82 mollion, covers nearly 100 mu and has
more than 500 employees. The company was rewarded the" Model Enterprise of Single Champion in Manufacturing lindustry ", provincial
"postdoctoral workstation", "high-tech enterprise", and "NTASM200 Integrated circuit auto molding system", that were fiuly supported
by Anhui province science and technology administration. Nextool holds 76 patented technologies, including 31 invention patents.
The company's flagship products include the 180T and 120T auto packaging systems, auto DTFS system, molds for plastic packaging
and trimming, and the development of board-level and wafer-evel encapsulation machines.

The company adheres to the mission of "creating more value for you" and the business philosophy of "sustainabiity, innovation
cooperation, and harmony, providing technoloaicaly advanced, quaity-stable, and more eficient eauipment. We persistently utilize
cutting-edge technology, ensure impeccable quaity, and deliver prompt and thoughtful services to satisfy our customers, thus pro
moting faster, higher, and stronger development of the global semiconductor industry.

 Press Releases

  • NEXTOOL's flagship products include the 180T and 120T auto packaging systems, auto DTFS system, molds for plastic packaging
    and trimming, and the development of board-level and wafer-evel encapsulation machines.

 Products

  • 180T/120T Auto Molding System
    For post-process packaging of IC, semiconductor device and LED substrates. The applicable product packaging forms are: SOP, SOT, SOD, SMA, SMB, DFN, QFN, QFP, BGA, SCP, PLCC, MCM, IGBT, IPM, TO, LED substrates and etc. ...

    • NTAMS180/120 structure：
    NTAMS120/180 including：
    1. Magazine loader
    2. Leadframe infeed
    3. Leadframe alignment
    4. Leadframe preheat
    5. EMC pellet infeed
    6. P&P loader
    7. P&P offloader
    8. Degeter
    9. Slot/stack offloader)
  • DTFS System
    Automatically complete trimming, forming, singulation, automatic pipe installation and other actions with high efficiency that can greatly reduce labor cost for customers....

    • Multi-option function confguration, apply for customize product needs of differenct users:
    CCD positive and negative detection on product's feeding type
    CCD detection on joints' cutting and abnormal pin
    Track, mold destaticizer (ion blowing)
    Dedicated counting function for mold punching (mold counter)
    OR code scanning
    SECS network communication
  • Auto MGP Packaging System
    The AUTO-MGP packaging system is a new automated packaging system that utilizes a traditional 450T servo plastic sealing machine and MGP molds to achieve full automation in production. It features low cost and high production capacity. ...

    • Main Functions:
    1. Automatic feeding of lead frames with L/F direction detection
    capability.
    2. Automatic supply of material reels with weighing function.
    3. Automatic mold cleaning and vacuuming function.
    4. Automatic runner punching and material collection function.
    5. Support for SECS protocol for semiconductor communication.
    6. Data query and backup function.
    7. External CCD inspection function (optional).

Categories

200 Packaging and Assembly Equipment
  • Cut & Down Set; Trim; Form Equipment
  • Deflashing; Degating Tools
  • Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners
  • Molding; Encapsulation; Decapsulation Equipment
  • Package Simulation; Characterization Equipment

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