Techno Horizon will showcase 1) an advanced X-ray CT scanning system optimized for semiconductor package inspection and 2) SWIR camera suitable for semiconductor wafer inspection.
Our new X-ray CT scanning system, TI-X900s, achieves high image resolution up to 0.16um and automated bump / LTH inspection/measurement software equipped. This is the ideal solution for the advanced semiconductor packaging inspection. Our key engineers are looking forward to talking to you about your challenges of semiconductor packaging inspection.
BV-C3160GE is a brand-new SWIR 5MP camera, which is suitable for semiconductor inspection. Please visit our booth and check the superior image quality. We look forward to hearing about your challenges with optical wafer inspection.