Park Systems Europe GmbH

Unique features:

• Low noise Atomic Force Profiler for accurate, high throughput CMP profile measurements
• Sub-Angstrom surface roughness measured with extreme accuracy and minimized tip-to-tip variation

Smart ADR Software

Park's Smart ADR NX-Wafer provides fully automated defect review and identification, enabling a critical inline process to classify defect types and source their origin through high resolution 3D imaging.
Designed specifically for the semiconductor industry, Smart ADR is the most advanced defect review solution available, featuring automatic target positioning without the need for labor intensive reference marks that often damage the sample. The Smart ADR process improves productivity by up to 1,000% compared to traditional defect review methods. Additionally, the new ADR capability offers up to 20x longer tip life thanks to Park's groundbreaking True Non-Contact™ Mode AFM technology.

Read more: https://www.parksystems.com/en/products/in-line-metrology-afm/wafer-fabrications/nx-wafer 

Unique features:

• Enhanced AFM Core Technology
• Handles Wafers and Multiple Samples
• Intelligent Automation
• Simplified Operation
• Next Generation AFM Controller for High-End Products

Boasting an advanced mechanical structure that ensures a significantly lower noise floor, minimal thermal drift, and exceptional stability, the FX200 sets a new standard in precision and reliability. Its faster Z servo performance and improved high-power sample view enhance operational efficiency and imaging capabilities, while features like automatic probe recognition and probe exchange, laser beam alignment, and macro optics for full sample view simplify user experience and maximize productivity. With optical autofocus, navigation, and sequential measurements at multiple coordinates, coupled with automated AFM scan parameter settings, automated data analysis, the FX200 streamlines complex operations, making it the ideal choice for both research and industrial applications. Delivering superior performance and ease of use, Park FX200 stands poised to revolutionize nanoscale imaging and analysis, empowering scientists and engineers to achieve unprecedented insights and advancements in their fields.

Read more: https://www.parksystems.com/en/products/research-afm/large-sample-afm/fx200

Key Features

• No risk of damage and seamless repair of any type of defects
• Compatible with a dual pod for handling EUV masks
• All-in-one solution for locating defects and post-repair verification

Revolutionizing photomask repair, the Park NX-Mask system addresses the challenges of shrinking device sizes and increasing photomask complexity with its advanced AFM technology. It precisely removes defects without the damage risks associated with E-beam or laser systems, maintaining the integrity of the reflective surface and patterns. With a unique depth control of ±7.5 µm, NX-Mask efficiently handles various defect types and integrates smoothly into in-line processes for quick repairs.

Read more: https://www.parksystems.com/en/products/in-line-metrology-afm/photomask-repair/nx-mask

A fully automated industrial AFM using NX technology

• NX technology automatically constructs an extremely accurate topographical image and collects essential dimensional data
• The low-noise Z-detector works on an independent, closed loop to minimize errors in topography
• True Non-ContactTM mode allows for the collection of high-resolution and accurate data without tip-sample damage

Innovative head design for undercut and overhang structures

• Patented decoupled XY and Z scanning systems work together with the tilted Z-scanner, letting users overcome normal challenges in accurate sidewall analysis associated with normal and flare tip methods
• Z-head tilting mechanism allows access to the sidewalls using an ultra-sharp tip to obtain the same high resolution and definition as is obtained over the rest of the material

A Reliable, Seamless Measurement Tool for 3D materials

• No sample preparation is required to obtain the sidewall roughness or critical dimension measurements in this process
• By utilizing Z-head tilting and True Non-ContactTM mode, the NX-3DM allows for both tip-preserving and high-resolution collection of sidewall data

Read more: https://www.parksystems.com/en/products/in-line-metrology-afm/wafer-fabrications/nx-3dm

As the demand for Atomic Force Metrology for larger flat panel displays increases, Park NX-Tip Scan Head overcomes nanometrology challenges for samples over 300mm. The Tip Scanning Head (TSH) and gantry style air-bearing stage allows Park NX-TSH to accurately image roughness measurement, step height measurement, and critical dimension measurement.

The fully Automated Tip Scanning Head for OLED, LCD, and 2D encoder sample

• Tip Scanning Head in X, Y and Z directions, up to 100 µm x 100 μm (x-y direction) and 15 μm Z-direction
• Flexible chuck to accommodate large and heavy samples over 300mm and 1KG
• Long Range Air-bearing XY stage for AFM analysis of industrial samples larger than 300 mm
• 100 µm x 100 µm Flexure-Guided XY Scanner with Closed-loop Dual Servo System
• 15 µm High Speed Z Scanner with Low Noise Position Sensor
• Automatic Measurement Control and automated system features such as live monitoring of the measurement process, automatic analysis of acquired measurement data, and more!

Read more: https://www.parksystems.com/en/products/in-line-metrology-afm/flat-panel-display/nx-tsh

Key Features

• Modular setup: Easy upgrades between different configurations from BAM, single wave-, multiwave- to full spectroscopic ellipsometer

• Spectroscopic imaging ellipsometry from 190/250/360 nm to 1000/1700/2700 nm

• Highest lateral ellipsometric resolution of 1 µm, allowing to determine thickness and refractive index on microstructures as small as 1 µm

• Ellipsometric enhanced contrast images for a live visualization of the sample

• First identify, then measure: Intuitive selection of measurement region by drawing region in live view

• Parallel measurement of multiple regions within the selected field of view

• Knife-edge illumination for the non-destructive suppression of disturbing backside-reflections

• Enlarge your measurement possibilities by using additional accessories, e.g. cells, temperature control or liquid handling

• Quality Control: Also available as OEM version for QC in product lines

Read more: https://www.parksystems.com/en/products/ellipsometers/imaging-spectroscopic-ellipsometry-/ep4