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scia Systems GmbH

Clemens-Winkler-Str. 6c
Chemnitz,  09116

Germany
http://www.scia-systems.com
  • Booth: C2235


scia Systems - Equipped for Precision

scia Systems develops and manufactures equipment with complex plasma and ion beam technologies for ultra-precise surface processing. The systems are applicable for coating, etching and cleaning processes, especially for the MEMS, microelectronics and precision optics industries. Due to their flexible and modular design, the process equipment can be configured according to customer specific requirements, for research applications as well as high volume production in either a "cluster" or "inline" configuration.

Our wide range of processing technologies includes etching processes, like Ion Beam Trimming, Ion Beam Milling and Reactive Ion Etching as well as coating processes such as Ion Beam Sputtering, PECVD and Magnetron Sputtering.


 Press Releases

  • scia Systems’ high-precision ion beam process solutions are enabling the automotive, cloud computing, AR/MR, and mobile communications industries

    Chemnitz, Germany, October 28, 2024 – scia Systems GmbH, an industry leader in advanced ion beam and plasma process equipment for microelectronics, MEMS, and precision optics industries, today announced that it will highlight key advances in ion beam processing for semiconductor, sensor, and photonic integrated circuit (PIC) manufacturing at SEMICON Europa 2024. scia Systems’ high-precision solutions are playing an essential role in enabling many of today’s high-growth consumer and industrial applications.

    According to Dr. Michael Zeuner, CEO of scia Systems, “As semiconductors, sensors, and optical devices increase in complexity due to smaller features, new exotic materials, and more layers and complex structures, the processes used to manufacture them require higher levels of precision. Our advances in ultra-precision ion beam process technologies are enabling manufacturers’ success in producing these devices, which are driving cloud computing, augmented/mixed reality (AR/MR), automotive, telecommunications, and many other industries. A case in point, every modern cell phone has components that have been manufactured using a scia Systems product. We look forward to highlighting these solutions, as well as the many high-growth applications that they enable, at SEMICON Europa.”

    Ion beam etching solutions enable significant growth in photonic integrated circuits

    Demand for PICs is growing rapidly in telecommunications and data centers due to their wide bandwidth, low transmission loss, and numerous other advantages over traditional electronic integrated circuits. Integrating new materials, material stacks, and designs requires new etching solutions. scia Systems’ advanced ion beam etching and trimming processes enable manufacturing of three-dimensional optoelectronic microstructures for PICs, such as waveguides and other optical components. Reducing microroughness by ion beam trimming is another promising application area that enhances the production of high-performance PICs. Further applications include nano-structured surface relief gratings for AR/MR systems, and surface form error correction for telescope mirrors, X-ray optics, lenses, and conventional optics.

    Ion beam etching technology produces GMR/TMR sensors for mega markets

    High-precision sensors that use magnetic storage, most notably giant magnetoresistance (GMR) and tunnel magnetoresistance (TMR) sensors, are used to detect any type of motion including proximity, rotations or vibrations. These have been rapidly adopted across a wide variety of industries and applications, including automotive electronics, industrial equipment, and cloud storage. However, the complex, multi-layer composition of these sensors creates significant challenges for traditional chemical and dry etching processes, which have difficulty processing magnetic materials. scia Systems overcomes these limitations with its high-precision ion beam etching technology, enabling the manufacture of high-performance GMR sensors for flexible and wearable electronics, including AR/MR headsets, and TMR sensors for Internet of Things (IoT), automotive, smart home, eMobility, and many other applications.

    Ion beam etching solutions for precision reverse engineering of ICs

    Reverse engineering is an essential step in semiconductor manufacturing. By conducting verification, failure analysis, and research of internal device structures, engineers can isolate and troubleshoot problems to improve manufacturing yields. Reverse engineering involves exposing internal components, delayering to analyze each layer of the device, imaging, and post-processing. Conventional delayering processes such as wet chemical etching, CMP or plasma etching are often expensive, error-prone, and limited in application. scia Systems’ ion beam etching technology enables precise processing within the micro- and nanometer-size range and atomic-level-thickness range for different materials at once.

    See scia Systems at SEMICON Europa

    SEMICON Europa attendees interested in learning more about scia Systems and its advanced ion beam and other thin-film process solutions are invited to visit us at Booth #C2.235 on November 12 - 15 in Munich.

    About scia Systems GmbH

    Founded in 2013, scia Systems is a technology leader in thin-film process equipment based on advanced ion beam and plasma technologies. The systems are used for coating, etching, and cleaning processes with nanometer resolution and have been successfully implemented in various high-tech industries worldwide, including microelectronics, MEMS, and precision optics industries. For more information, visit the company’s website at www.scia-systems.com

    Company Contact:

    Mandy Gebhardt
    Head of Marketing
    scia Systems GmbH
    Tel: +49 371 33561 322
    E-Mail: [email protected]


 Products

  • scia Mill 200
    System for full surface ion beam etching and milling of substrates up to 200 mm. A typical application is the structuring of complex multilayers of various materials....

  • The scia Mill 200 is designed to structure complex multilayers of various materials. Different end-point detection systems can be equipped for exact process control. With its fully reactive gas compatibility, the system enables reactive etching processes with enhanced selectivity and rate. The flexible design of the scia Mill 200 allows it to be adapted as a single substrate version as well as in a high-volume production cluster layout with up to three process chambers and two cassette load locks. 

    Features & Benefits

    • Etching angle adjustment with a tiltable and rotatable substrate holder
    • Excellent uniformity without shaper
    • Enhanced selectivity and rate with reactive gases

    Applications

    • Structuring of magnetic memory (MRAM) and sensors (GMR, TMR)
    • Milling of metals in MEMS production (Au, Ru, Ta, …)
    • Milling of multilayers from diversified metal and dielectric materials
    • RIBE or CAIBE of compound semiconductors (GaAs, GaN, InP, …)
    • Production of surface relief gratings (SRG)
    • Ion beam smoothing for reduction of microroughness
  • scia Trim 200
    Ion beam trimming system for high precision surface trimming of wafers, without limitations in film and wafer materials. They were typically used for frequency trimming in the manufacturing of acoustic-electrical devices and post-CMP processing....

  • The scia Trim 200 is used for high-precision surface trimming of wafers without film and wafer materials limitations. Designed for high-volume production, the system has a throughput and maintenance-optimized layout with a semiconductor cassette handling robot that accommodates all standard wafer sizes. In addition, a cluster configuration with two process chambers and two cassette load locks is available.

    Features & Benefits

    • Significant yield improvement
    • High precision and high throughput for low production costs
    • No edge exclusion with electrostatic chuck
    • Sub-nanometer removal with zero base etch function

    Applications

    • Frequency trimming of bulk acoustic wave (BAW) or surface acoustic wave (SAW) filters
    • Thickness trimming of silicon on insulator (SOI), quartz, lithium tantalate (LT) or lithium niobate (LN) wafers
    • Film thickness error or step height correction in thin film head (TFH) manufacturing
    • Dimensional correction of MEMS structures

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