Fabmatics GmbH

Discover the Test Wafer Center – Revolutionizing Test Wafer Management

Test wafers are essential for semiconductor manufacturing but managing them manually is time-consuming and prone to error.

The Test Wafer Center (TWC) fully automates kitting, storage, re-sorting, and de-kitting, streamlining your test wafer logistics and ensuring precise, just-in-time delivery. 

Its compact and highly flexible layout allows up to 93 storage bins and up to 14 material handling locations making it the perfect solution for complex equipment qualifications scenarios.

It gives you complete (remote) control for determining timing and content of each test wafer lot & enables just-in-time delivery to your process equipment.

KEY FEATURES & BENEFITS

Speed & Efficiency

• Commissions test & qualification lots fully automated, just-in-time and with complete traceability
• Reduces carrier transfers freeing up AMHS or manual transport capacity

Cleanliness & Material Protection

• Operates within its own ISO 3 mini environment, suitable for gray space installations & boasting a dedicated ultra-clean wafer handling area
• Detects handling errors (cross-slotting, double slotting etc.) & data inconsistencies (missing wafer, extra wafer, wrong wafer)

Space & Footprint

• Frees up expensive cleanroom space with a centralized test wafer management solution instead of numerous scattered handlings tools
• Allows layout optimization with an advanced design ideal for tight spaces, suitable even for a wall or corner installation

Resource Optimization

• Builds a complete wafer history with uninterrupted substrate tracking per SEMI E90
• Features automated error recovery & speeds up maintenance procedures providing best-in-class OEE via its auto-inventory function

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Discover the future of safe reticle pod transport with the HERO Scout – your solution for efficient and reliable production in the semiconductor industry.

With its cutting-edge 6-axis cobot and ultra-compact design, the HERO Scout is perfectly suited to navigate narrow aisles and efficiently manage reticle pod handling at various heights. As the smallest cleanroom-compatible autonomous mobile robot on the market, it impresses with its ultra-clean quality and maximum reach.

KEY FEATURES & BENEFITS

• Compact Design: Optimized for cleanrooms, it operates seamlessly in narrow aisles and tight fab spaces.
• Precision & Flexibility: The 6-axis cobot arm effortlessly handles high and challenging positions.
• Safe & Autonomous: Advanced 3D cameras and sensors ensure safe navigation alongside human workers.
• Fast Setup: SLAM-based navigation and auto-teaching enable quick deployment with minimal adjustments.
• Cleanroom Compatibility: ISO 2 certified, meeting the highest cleanliness standards for controlled environments.
   

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The FOUP Purge System by Fabmatics is an innovative solution designed to enhance the reliability of wafer storage during interim processing. This retrofittable system effectively purges Front Opening Unified Pods (FOUPs) with inert gas, such as nitrogen (N2), to safeguard wafers from undesired chemical reactions triggered by humidity and evaporation.

The FOUP Purge System stands at the forefront of semiconductor manufacturing, particularly for leading-edge companies operating at process nodes of 28 nm and below.

Key Features:

Retrofittable Design: Seamlessly integrates with existing storage modules, such as Zero Footprint Storage (ZFS) or Purge Stockers, without necessitating changes to the fab infrastructure during regular operations.

Independent Purge Functionality: Each nest within the system can be individually purged, ensuring zero gas waste or spillage, which maximizes operational efficiency.

Consistent Gas Flow: The system maintains a constant flow of inert gas throughout the entire storage duration, ensuring optimal protection against oxidation and contamination.

Monitoring and Control: Every purge nest is equipped with individual monitoring and control capabilities, providing precise oversight of the environmental conditions for each wafer.

Benefits:

Prevention of Airborne Molecular Contamination (AMC): By utilizing inert gas purging, the system effectively mitigates the risk of airborne molecular contamination and other chemical reactions that can adversely affect wafer integrity.

Extended Queue Time: The FOUP Purge System allows for longer storage periods between process steps, facilitating increased flexibility in manufacturing workflows.

Enhanced Process Yield: By protecting wafers from environmental threats, the system contributes to a significant improvement in overall process yield, thereby reducing waste and enhancing productivity.

Applications:

The FOUP Purge System is essential for semiconductor manufacturing environments where maintaining a contamination-free atmosphere is critical. Ideal for applications in:

• Advanced wafer processing
• Cleanroom environments
• High-precision semiconductor fabrication
   

Brochure Download: For more detailed information, download our Brochure for the FOUP Purge System.

The FOUP Purge System by Fabmatics is a game-changing solution that ensures the integrity of wafers during storage, thereby playing a vital role in enhancing the efficiency and yield of semiconductor manufacturing processes. Embrace cutting-edge technology and ensure superior wafer protection with the FOUP Purge System.