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Electron Mec S.r.l.

Via degli Abeti 17/7
Gorgonzola MI,  20064

Italy
https://www.electron-mec.com/
  • Booth: C1419


High-technology transfer from global suppliers to end users.

Electron Mec

Since 1960 we support and promote flawless High-Technology transfer from global supplieres to end users.

Electron Mec is committed to provide best in class equipment and services to high tech customers in Europe, meeting and exceeding their requirements.

We offer complete solutions, equipment, material and applications consulting for nanaoand microstructure fabrication, packaging and micro assembly, surface treaments, testing and characterization, and machine vision.

 Products

  • Electron Mec, Curing Clean Ovens, Despatch PCO
    - Drying ovens - Polyamide curing clean ovens -Class A ovens (works with flammable solvents)...

    • PCO2-14 Poyamide Curing

    • max temp: 350 degree C
    • HEPA filtered ISO 5
    • Silicon free construction
    • Oxygen montor
    • Nitrogen atmosphere
  • Electron Mec, Hottima, Hotplate
    High precision Hotplate for scientific and industrial application...

    • Best temperature high precision accuracy

    Temperature up to 450 degree C

    Temperature Uniformity 1,5 %

    Average heating rate 35 degree C/min

  • Electron Mec, Nanovak Deposition Systems
    ​Sputtering and Evaporation System...

    • e-Beam Evaporation, Load-Lock Equipped Coating Systems, Glove-Box Integrated Vacuum Systems, Thermal and Sputtering Combined Systems, High Power Sputtering (HiPIMS) Systems, Magnetron Sputtering Systems, Bell-Jar Type Thermal Systems

  • Electron Mec, Thinklaser Wafer Laser Marking
    SC300, SigmaDSC, SigmaClean, HM300...

    • Class 1 cleanroom compatibility and ultra-stable patented diode-pumped laser for hard marking, soft marking, 200mm and 300mm wafers
  • Electron Mec, Wire Bonding, TPT, HESSE
    Manual, semi-automatic and fully automatic wire bonders and materials...

    • Thin and heavy wire bonders for development and full production. Wedge, ball, deep access. SPM tools and capillaries
  • Electron Mec, Dispensing Musashi, Namics
    Automatic Micro Dispensing Equipment, Sinter Pastes, Adhesives...

    • Time/Pressure High precision dispensing system. Jet dispensing. Slit nozzle, wide range of dedicated needles and tooling.

    Chip-on-Film Underfills (encapsulants), Flip Chip Underfills (encapsulants), Dam-and-Fill Encapsulants, CSP/BGA Board Level Underfills (encapsulants), Die Attach Adhesives (conductive, heat-curing type), HIMEC: Sintering-type Conductive Paste

Categories

200 Packaging and Assembly Equipment
  • Cleaning; Washing Equipment for Assembly & Packaging
  • Dicing; Sawing; Scribing; Separation Equipment
  • Die Bonding; Attach Equipment
  • Die Sorter; Pick & Place; Flip Chip Placement Systems
  • Dispensing Systems
  • Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners
  • Solder Reflow; Soldering & Brazing Equipment
  • Wafer Level Bonders
  • Wafer Mount; Taping Equipment
  • Wire Bonding Equipment
    • 202 Other Equipment
  • Heating; Annealing; Curing Equipment - Furnaces; Conveyors; Ovens; Test Chambers; Heat Treating
  • Repair; Rework Equipment
    • 203 Inspection & Measurement Products
  • CV (capacitance-to-voltage) Probe systems
  • Defect; Particle; Bump; Contamination Detection, Review or Inspection
  • Die Inspection; Die Shear
  • Resistivity Measurement; 4 point probe; Sheet resistance
  • Stress; Refractive Index; Reflectivity & Conductivity Measurement
  • Thermal Sensing, Measurement, Analysis
  • Wire Bonding Inspection; Test
    • 204 MEMS Equipment
  • Deep RIE etching; Dry Etching
  • Double sided mask aligner
  • Wafer Level Bonders
    • 205 Nanotechnology Equipment and Tools
  • Equipment, Nanotechnology Tools
    • 206 PV Equipment
  • Thin Film
    • 207 Process Equipment
  • Coat; Develop; Resist Processing; Track Equipment
  • Deposition; Chemical Vapor (CVD); MOCVD; PECVD; LPCVD; ALD; REALD; MVD
  • Deposition; Physical Vapor (PVD); Sputtering; Evaporation Equipment
  • Environmental Enclosures; Minienvironments
  • Etching; Stripping; Ashing - Dry and Wet Equipment
  • Lithography; Exposure; Aligners; Direct Write Systems; Steppers; Scanners; Nanoimprint
  • SOI Bonders; Temporary Bonders; De-Bonders
  • Spin on Glass (SOG); on Dielectric (SOD) Track systems
  • Thermal Processing - Diffusion; Oxidation; Annealing; RTA; RTP Equipment
  • Wafer Identification; Marking Equipment
    • 208 Test Equipment
  • Burn-In Systems
  • Failure Analysis Systems
  • FPD Test; Measurement; Repair Equipment
  • Printed Circuit Board; Wire Board (PCB or PWB) Test and Repair
  • Probing Equipment incl. Analytical; Circuit; Manual; E-Beam; Optical; Wafer Probers
    • 300 Packaging and Assembly Materials
  • Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive
  • Bonding; Interconnect Materials - Wire; Ribbon; Tape; Capillaries & Tools
  • Printed Circuit Boards (PCB); Printed Wire Boards (PWB)
  • Scribe Tools; Saw or Dicing Blades and Accessories
  • Thick Film Pastes; Materials
    • 309 Test Materials
  • Burn-In Boards; Performance Boards (incl. Low; High Temp and Ceramic)
  • Test Sockets; Contactors and Contact accessories
    • 500 Factory Monitoring & Control Systems (FMCS)
  • Gas Handling - Cabinets; Control; Supply Systems
  • Waste Control; Effluent Management Systems (Fluid & Gas; Exhaust Conditioning; Scrubbers)
    • 701 Manufacturing Services or Consulting
  • Clean Room; Contamination Control
  • Environmental, Health & Safety

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