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JP Kummer Semiconductor Technology GmbH

Steinerne Furt 78
Augsburg,  D-86167

Germany
https://www.jpkummer.com
  • Booth: C1365

European distributor mainly for the Semiconductor Industry

JP Kummer Semiconductor Technology GmbH is a specialist European distributor of instruments and consumables mainly for the Semiconductor Industry. Using our long established relationships within the worldwide Industry we bring the newest and most technologically advanced products to the European market.
We are specalist for: wafer prober, probe card analyzer and avalanche tester, wafer thickness, geometry, resistivity, surface inspection, slot-die coating, decapsulator (mechanical, by laser and etching) and de-layering systems, SEM/TEM Sample Preparation Equipment, Scanning Acoustic Microscope, curve tracer, plasma cleaning, Vacuum bake/Vapour prime ovens, OES, XRF, TXRF and XRD, calibration standards,Topography and Deformation Measurement (TDM)

Categories

201 Flat Panel Display Equipment
  • Alignment Film Coating Equipment
  • Color Pattern Processing Equipment
  • Luminous Layer Patterning and Sealing Equipment
  • Seal Patterning Equipment
    • 202 Other Equipment
  • Heating; Annealing; Curing Equipment - Furnaces; Conveyors; Ovens; Test Chambers; Heat Treating
  • Repair; Rework Equipment
    • 203 Inspection & Measurement Products
  • Defect; Particle; Bump; Contamination Detection, Review or Inspection
  • ESCA; Ultrasonic; Acoustical Microscopes
  • Film Thickness; Thickness; Uniformity Measurement; Ellipsometer
  • Microscopes: Confocal Scanning Microscope; 3-D Video Microscopes
  • Resistivity Measurement; 4 point probe; Sheet resistance
  • Stress; Refractive Index; Reflectivity & Conductivity Measurement
  • Thermal Sensing, Measurement, Analysis
  • Wafer; Substrate Metrology; Topology; Nanotopography; Flatness Measurement; Crystalline Orientation
    • 206 PV Equipment
  • Inspection and Metrology
  • Wafers
    • 207 Process Equipment
  • Coat; Develop; Resist Processing; Track Equipment
  • Thermal Processing - Diffusion; Oxidation; Annealing; RTA; RTP Equipment
    • 208 Test Equipment
  • Environmental Stress Systems - Temperature; Humidity; Pressure; HAST
  • Failure Analysis Systems
  • Probe Card Maintenance and Analysis Systems
    • 300 Packaging and Assembly Materials
  • Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive
    • 309 Test Materials
  • Probe Cards; DUT boards and other probing accessories (incl Ceramic and Special Purpose Probe Cards)
  • Test Sockets; Contactors and Contact accessories
    • 700 Manufacturing Services
  • Calibration & Reference Standards
    • 804 Professional Services
  • Sales; Manufacturers Representation or Distributors
    • 900 Support Products
  • Analytical Standards; Calibrators
    • 901 Printed, Organic, Flexible and Large Area
  • Equipment: Printing, coating
  • Equipment: Systems

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