Aehr Test Systems

400 Kato Terrace
Fremont,  CA  94539

United States
http://www.aehr.com
  • Booth: C2707


Aehr Test Systems

Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer level, singulated die, and package part form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, data and telecommunications infrastructure, and solid-state memory and storage


 Products

  • FOX-XP
    Advanced Test System for Multiple Wafers and Individual Die/Modules - Efficient High-Throughput Solution for Burn-in and Testing of Logic, Memory, Photonic, and Power Devices...

    • Optimized High-Throughput System for Reliability Verification and Testing in Volume Production
      • Accommodates full wafers, panels, singulated dies, and modules, maximizing production efficiency.
      • Detects defects in logic, memory, photonic, and power dies before final packaging integration.
      • Up to 18 Blades (slots) for wafer or panel examination using WaferPak™ contactors.
      • Supports up to 9 Blades for precise testing of wafer, singulated die and module DiePak® carriers.
      • Advanced high-power testing capability with up to 3,500 watts of power per wafer
    • Flexible Channel Resource Configuration for Enhanced Versatility
      • Each Blade (slot) supports various resource modules: Universal Channel Modules, High Voltage Channel Modules, and High Current Channel Modules.
      • Offers up to 2,048 Universal Channel resources per Blade, including I/O, Clock, PPMU, and DPS, with deep scan, pattern data, and capture memory per channel for testing devices with BIST/DFT capabilities.
      • Provides up to 1,024 resources per Blade for high voltage (up to 29V) and high current (up to 2A) source requirements.
    • Production Proven Full-Wafer Reliability Verification & Test Solution
      • Lowers testing expenses by enabling functional testing of wafers, dies, and modules during the reliability verification process.
      • Provides a comprehensive solution when equipped with a WaferPak contactor or DiePak carrier, complemented by a Wafer Aligner or DiePak Loader.
      • Ensures device safety with individual per-channel protection against over-current and over-voltage incidents.
  • FOX-NP
    Comprehensive Test System for Full Wafers and Individual Die/Modules - Compact and High-Power Testing and Reliability Verification Solution for Logic, Memory, Photonic, and Power Devices...

    • Compact and Versatile High-Throughput Solution for Reliability Verification and Testing
      • Capable of handling applications involving full wafers, panels, singulated dies, and modules.
      • Efficiently detects failures in logic, memory, photonic, and power dies prior to final package integration.
      • Features a high-power thermal chuck with dual Blade (slot) capability, compatible with WaferPak™ contactors or DiePak® carriers for singulated die or module testing.
    • Economical High Power Wafer, Die, and Module Verification and Test Solution
      • Versatile channel resource configurations per Blade (slot), including Universal Channel Modules, High Voltage Channel Modules, or High Current Channel Modules.
      • Features up to 2,048 Universal Channel resources per Blade, encompassing I/O, Clock, PPMU, and DPS, equipped with deep scan, pattern data, and capture memory for each channel, ideal for testing devices with BIST/DFT.
      • Provides up to 1,024 high voltage (up to 29V) or high current (up to 2A) source resources per Blade.
    • Production Proven Full-Wafer Reliability Verification & Test Solution
      • Decreases testing expenses by enabling functional testing of wafers, dies, and modules during the reliability verification phase.
      • Provides an all-encompassing solution when set up with a WaferPak contactor or DiePak carrier, along with a Wafer Aligner or DiePak Loader.
      • Ensures device safety with individual per-channel protection against over-current and over-voltage.
  • Sonoma
    A high-power system for AI and HPC applications...

    • High power
      • More Reliable Power and Stimulus delivery
      • Localized power supplies and stimulus controller for better signal integrity
    • Production Ready
      • Multi-step test plans
      • GUI front end for easy user interaction
      • No BIM removal required for device load/unload
    • Thermal Management
      • Liquid-cooled or air-cooled options
      • Up to 2000W per device
      • Up to 22 slots per system
      • Individual socket thermal control
  • Tahoe
    A flexible, modular system for test and burn-in of low- to medium-power logic devices...

    • More DUTs per System
      • Larger BIBs – up to 457mm x 610mm
      • Up to 24 BIBs per system
      • Individual Socket Thermal Control or Chamber Temperature Control
    • Up to 688W per BIB
    • Production Ready
      • Multi-step test plans
      • GUI front end for easy user engagement
      • Full lot management with auto adjusting due dates
    • Better Chamber
      • Better Airflow and Temperature Uniformity
      • Small System Footprint

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