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SYNOVA SA.

Rte de Genolier 13
Duillier,  1266

Switzerland
http://www.synova.ch
  • Booth: C2752

Synova S.A., headquartered in Duillier, Switzerland, develops, manufactures, and sells advanced laser machining systems that incorporate its proprietary water jet guided laser technology (Laser MicroJet®) in a true industrial CNC platform. The hybrid Laser MicroJet (LMJ) method of machining combines a laser with a "hair-thin" water jet that precisely guides the laser beam by means of total internal reflection.

Synova’s 3 and 5-axis machines allow fast and precise machining of a wide range of materials, from metals to ultra-hard and brittle materials such as diamond or ceramic, to complex composites – without thermal damage, debris deposition and taper. The company has delivered over 500 machines worldwide, designed for applications such as drilling cooling holes in turbine blades, faceting rough diamond stones and processing semiconductor equipment consumables.

The Synova group employs over 130 people worldwide, including 40 engineers, who mainly focus on researching new material cutting solutions, further applications and laser cutting equipment. Synova has established subsidiaries in the USA, Germany, Japan, India, Korea, China, South Africa and the United Arab Emirates for optimized customer support.


 Products

  • LCS 305
    The LCS 305, with integrated water jet guided laser technology, is a five-axis CNC machine for automatic production of large and small diamond cutting tools. It features an intelligent machine concept and highly dynamic axes for high precision and speed....

  • The LCS disposes of consistent temperature control with water-cooled linear and torque motors (+/- 0.1°C) and a mineral casting machine bed for more stability and reduced vibrations.

    A fully automatic offset calibration system integrates laser-nozzle alignment, automatic jet angle correction, laser power meter and touch probe.

    Tools can be exchanged with a very high accuracy thanks to the HSK 63 tool holder.

    Materials:

    Hard materials: Polycrystalline CBN (PcBN), polycrystalline diamond (PCD), single crystalline diamond (SCD), chemical-vapor-deposition (CVD) diamond, natural diamond (ND), tungsten carbide (WC)

    Metals: Superalloys, stainless steel, aluminium, copper, titanium, nickel etc. 

    Ceramics: Ceramic-matrix composites (CMCs), silicon carbide (SiC), silicon nitride (SiN), zirconia (ZrO2), HTCC/LTCC (high temperature and low temperature co-fired ceramic), aluminum nitride (AlN), aluminum oxide (Al2O3)

    Operations

    3D cutting, shaping, drilling, slotting, grooving, trenching, milling, slicing, edge grinding (K-land edges, single or multiple clearance angles) engraving, profiling 

    Key Benefits
    • Virtually no heat impact thanks to water jet cooling capability
    • Cylindrical beam resulting in parallel kerfs (no V-shape)
    • Smooth cutting surfaces and sharp edges
    • Very small kerf width
    • Clean surfaces and no depositions
    • No focus control due to long working distance
  • LCS 800
    The LCS 800, a 3-axis laser cutting machine with Laser MicroJet® technology, offers versatile high-precision cutting and drilling for various industries. Its large mounting table suits any part size, ideal for small series, prototypes, and large volumes....

  • The main applications include machining of semiconductor equipment sub-assemblies, metal masks and other components made of metal, ceramics or composites (e.g. silicon carbide, CFRP).

    The LCS 800 has an intuitive and fully integrated system control interface with touchscreen functionality. The offset calibration system integrates automatic laser-nozzle alignment, automatic jet angle correction (both optional) and laser power control.

    Materials

    Ceramics & Composites: Silicon carbide (SiC), silicon nitride (SiN), ceramic-matrix composites (CMCs), CFRP, Zirconia (ZrO2), HTCC/LTCC, aluminium nitride (AlN), aluminium oxide (Al2O3)

    Metals:  Stainless steel, aluminum, copper, nickel, titanium, superalloys, etc.

    Ultra-hard materials:  Polycrystalline CBN (PcBN), polycrystalline diamond (PCD), single crystalline diamond (SCD), CVD diamond, natural diamond, tungsten carbide (WC)

    Operations

    2D cutting, drilling, slicing, slotting, grooving, trenching, milling, engraving, profiling

    Key Benefits
    • Virtually no heat impact thanks to water jet cooling capability
    • Cylindrical beam resulting in parallel kerfs (no V-shape)
    • Smooth cutting surfaces and sharp edges
    • Very small kerf width
    • Clean surfaces and no depositions
    • No focus control due to long working distance

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