The 300mm Polished Wafer is a meticulously processed semiconductor-grade silicon product, starting as a single-crystal ingot with a <100> crystal orientation. After being precisely cut into thin slices,the wafer undergoes a series of refining processes including shaping, polishing, and cleaning to achieve a mirror-smooth, ultra-clean, particle-free surface. According to different types of dopants, the Polished Wafer can be divided into P-type and N-type.