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Fraunhofer IZM - ASSID

Ringstr. 12
Moritzburg,  D-01468

Germany
http://www.izm.fraunhofer.de
  • Booth: C1419

The Center "All Silicon System Integration Dresden - ASSID" operates Fraunhofer IZMs leading edge, industry-compatible 200/300mm 3D wafer-level-process line with process modules for TSV formation, TSV post-processing, pre-assembly, wafer-level assembly, stack formation. ASSID is focusing on process development, material & equipment evaluation as well as R&D services for heterogeneous SiP solution.

Categories

203 Inspection & Measurement Products
  • Wafer; Substrate Metrology; Topology; Nanotopography; Flatness Measurement; Crystalline Orientation
  • X-ray; XRF; 3-D X-Ray; LEXES Systems
    • 207 Process Equipment
  • Deposition; Physical Vapor (PVD); Sputtering; Evaporation Equipment
  • Etching; Stripping; Ashing - Dry and Wet Equipment
  • Lithography; Exposure; Aligners; Direct Write Systems; Steppers; Scanners; Nanoimprint
  • Plating; Electro Chemical Plating; Deposition Systems
  • Spin on Glass (SOG); on Dielectric (SOD) Track systems
    • 300 Packaging and Assembly Materials
  • Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive
  • Bonding; Interconnect Materials - Wire; Ribbon; Tape; Capillaries & Tools
  • Packages; Ceramic and Other High Temp Compounds
  • Thin Film; Dielectric Film Materials
    • 308 Substrates
  • Silicon on Insulator (SOI); Silicon on Sapphire (SOS); Silicon Carbide;
    • 701 Manufacturing Services or Consulting
  • Assembly
    • 802 Educational; Research Institutions
  • Education; Research Institutions (Non Profit); Academia; Schools
    • 805 PV Services
  • Research and Development
    • 904 Electronic Applications
  • Healthcare: Flexible Intelligent Devices
  • Healthcare: sensors
  • Imaging: Camera and Camera Modules

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