LayTec AG

Seesener Str. 10-13
Berlin,  D-10709

Germany
http://www.laytec.de
  • Booth: C2236


Your partner for in-situ metrology

LayTec is a major provider of in-situ and in-line optical metrology for thin-film processes. These metrology tools are used in a broad range of thin-film applications such as LED & laser production, power devices and transistors, thin-film photovoltaics, oxide and organic deposition as well as other large area deposition processes. LayTec’s integrated metrology provides access to all key thin-film parameters in real-time – either in-situ, during the deposition process, or in-line. Also, in-situ metrology tools for dry etching have been added expanding LayTec’s portfolio along the production chain. Beyond these integrated methods, LayTec also offers mapping solutions which ideally complement in-situ measurements by providing uniformity analysis of the deposited layers. The implementation of LayTec metrology systems in production processes significantly shortens development cycles and enables an efficient quality control that helps to considerably reduce production and development costs.

For more information please visit www.laytec.de or contact [email protected]


 Products

  • EpiX®
    Comprehensive 2D analysis of optical wafer properties by non-contact measurements...

  • EpiX Mapping stations combine an XY-mapping stage with LayTec’s UV-VIS-NIR spectroscopic reflectance and photoluminescence metrology systems for a comprehensive 2D analysis of optical wafer properties by non-contact measurements. By optimizing the interplay of the individual mechanical and optomechanical components, the LayTec EpiX mapping stations have reached a superior measurement performance that stands out in absolute accuracy, signal-to-noise level and 2D-homogeneity over the wafer while maintaining short measurement times. The quality of the provided spectra enables advanced analysis capabilities. Integrated software provides full automated data analysis, including detection of VCSEL optical parameters (cavity dip, stop-band position), single layer, multiple layer and substrate thickness fits, film composition and multiple-peak analysis. Moreover, customers benefit from sample’s statistics and pass/fail classification on wafer-level and die-level.

  • EpiCurve® TT
    Combine wafer curvature measurements with emissivity-corrected pyrometry and growth rate/thickness measurements by three-wavelength reflectance....

  • To overcome the challenges that occur with larger wafers (4", 6", 8" or more), one needs the advanced EpiCurve® TT system. It combines wafer curvature measurements with all the features of the EpiTT: emissivity-corrected pyro­metry and growth rate/thickness measurements by three-wavelength reflectance. This tool will help to avoid cracking, achieve flat wafers and control temperature homogeneity (depending on the viewport size). Every curvature tool can be equipped with Advanced Resolution (AR) curva­ture measurements for wafer bow asphericity control (EpiCurve® TT AR).

    Fields of Application:

    • GaN LED and laser diode production
    • GaN power devices
    • GaAs/AlGaInP/InP laser diode production
    • Multi-junction solar cell production on GaAs, Ge, Si
    • SiC for power electronics
    • R&D for new materials and devices

  • TRIton®
    Our reflectometer for obtaining fully automated End Point Detection (EPD) during plasma etching processes....

  • LayTec’s TRIton is a reflectometer especially designed to obtain fully automated in-situ End Point Detection (EPD), during dry etch processes of various material systems. It may be used with different layer stacks, material/alloy compositions, initial layer thicknesses and wafer diameters.

    Fields of application:

    • EPD during ICP etching for nitrides, arsenides and phosphides
    • EPD during Atomic Layer Etching processes
    • Further processes may be addressed upon request

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