DEVELOP THE CHIPS OF THE FUTURE WITH SET FLIP-CHIP BONDERS.
SET is a world leading supplier of high accuracy Flip-Chip Bonders (Chip-to-Chip and Chip-to-Wafer) and versatile NanoImprint Lithography (NIL) solutions.
Since 1975, we have been designing and manufacturing semiconductor equipment dedicated to high precision applications.
Based in France, we accompany laboratories and industries of semiconductor, which look for a high precision and an important reliability in the assembly of their components.
With Flip-Chip Bonders installed worldwide, SET is globally renowned for the unsurpassed accuracy and the flexibility of its equipment.
Ranging from manual loading to fully automated version, our Flip-Chip Bonders cover a wide range of bonding applications and offer the unique ability to handle and bond fragile and small components onto substrates up to 300 mm.
SET offers a comprehensive product portfolio of Flip-Chip Bonders for fast growing markets and serving clients through a global network of representatives and in-depth customer trainings.