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Heidelberg Instruments Mikrotechnik GmbH

Mittelgewannweg 27
Heidelberg,  69123

Germany
https://heidelberg-instruments.com/
  • Booth: C1229


Experience the power of direct writing

Established in 1984, trusted in more than 50 countries with over 1,400 systems installed worldwide, Heidelberg Instruments is a global leader in design, development, and production of high-precision laser lithography systems, maskless aligners, and nanofabrication systems. Our tools range from tabletop solutions to high-end photomask manufacturing equipment and cater to a variety of needs. Our systems enable a broad spectrum of surface structuring on the micro- and nanoscale, including 2D-patterning, the creation of 2.5D features by Grayscale lithography, and 3D structuring through Two-Photon Polymerization. Due to their flexibility, our systems are valuable assets to the most renowned universities and R&D institutes worldwide, as well as industry production facilities. Typical fields of applications are in micro-optics and photonics, electronics, semiconductors/advanced packaging, quantum devices, MEMS, microfluidics, 2D materials, photomask production, and many others.

 Press Releases

  • Heidelberg, Germany—Heidelberg Instruments, a world-leading provider of advanced laser lithography systems, is pleased to announce a continued stream of orders for the ULTRA Semiconductor Mask Writer from photomask production groups across the US and Asia. This sustained demand highlights the company's commitment to delivering high-quality, reliable technology that meets evolving customer needs.

    Since launching its first ULTRA system six years ago, the company has consistently refined and advanced its technology to meet the increasing demands of semiconductor manufacturers worldwide. The ULTRA Semiconductor Mask Writer is specifically designed to create photomasks essential for fabricating a wide range of electronic devices, including microcontrollers, power management systems, LEDs, Internet of Things (IoT) devices, MEMS, and cutting-edge Artificial Intelligence (AI) applications.

    Key advantages of the ULTRA include:

    • Cost-Effective Solution with High Precision and Accuracy: The ULTRA can produce structure sizes as small as 500 nm while maintaining excellent critical dimension uniformity and superior image quality.
    • Efficient Production: With write speeds of up to 580 mm² per minute, the ULTRA ensures efficient and reliable mask production.
    • Seamless Integration: Its compact design allows easy integration into existing mask shop infrastructures, making it an ideal choice for semiconductor manufacturers looking to expand or upgrade their capabilities.
    • Advanced Features: The standard configuration includes fully automatic mask handling, a Zerodur® stage, low distortion optics, and high-precision position control, ensuring top-level performance and reliability.

    Looking ahead, the future of semiconductor photomask production is set for significant growth, driven by expanding applications in industries ranging from consumer electronics to automotive and industrial sectors. Heidelberg Instruments remains committed to leading the way with innovative solutions like the ULTRA, helping customers navigate the challenges and opportunities in this dynamic industry.

    For more information about the ULTRA Semiconductor Mask Writer, please visit https://heidelberg-instruments.com/product/ultra-semiconductor-mask-writer/

    About Heidelberg Instruments

    Established in 1984, trusted in more than 50 countries with over 1,400 systems installed worldwide, Heidelberg Instruments is a global leader in the design, development, and production of high-precision laser lithography systems, maskless aligners, and nanofabrication systems, offering solutions from tabletop tools to high-end photomask manufacturing equipment. Our versatile systems enable micro- and nanoscale surface structuring, including 2D-patterning, 2.5D features via Grayscale lithography, and 3D structuring through Two-Photon Polymerization. Renowned universities, R&D institutes, and industry production facilities worldwide rely on our systems for applications in micro-optics, photonics, electronics, semiconductors, quantum devices, MEMS, microfluidics, 2D materials, and more.

    Contact:

    Heidelberg Instruments Mikrotechnik GmbH

    https://heidelberg-instruments.com/

    press(at)heidelberg-instruments.com

    This press release is intended for informational purposes only. Heidelberg Instruments reserves the right to change product specifications without notice.

 Products

  • MLA 300 | MASKLESS ALIGNER FOR VOLUME PRODUCTION
    The MLA 300 Maskless Aligner integrates seamlessly into fully automated production lines with resolutions down to 1.5 µm. Areas of application are advanced semiconductor packaging, IR sensors, MEMS, electronic probes, high-precision electronic components....

    • MLA 300 Maskless Aligner

    Optimized for industrial manufacturing, the MLA 300 Maskless Aligner features distinct benefits for the wafer-level technology: The flexibility of maskless lithography allows rapid design customizations, and even unique designs on each substrate. This is of particular use for chip packaging where mounted die shift and each panel is unique. Meeting these demands, the MLA 300 can be seamlessly integrated into wafer-level packaging production lines, fully automating wafer production with a resolution down to 2 µm lines and spaces. The MLA 300 reduces production costs and efforts by eliminating mask procurement, verification, and management requirements. Operating costs are reduced by utilizing a long-lifetime exposure laser and fewer consumables. Modularity enables fast maintenance, replacement, or repair. Real-time autofocus compensates substrate warp or corrugations for flawless patterning.

  • DWL 4000 GS | THE INDUSTRIAL-LEVEL GRAYSCALE TOOL
    The expert Grayscale (GS) Lithography tool DWL 4000 GS provides advanced Grayscale technology that satisfies the highest industrial standards and produces 2.5D or freeform topographies such as micro-lenses or sloping features like blazed gratings....

    • DWL 4000 GS Grayscale Tool

    The DWL 4000 GS laser lithography systems is a fast and flexible high-resolution pattern generator, optimized for industrial-level grayscale lithography and designed for high-throughput patterning of masks and wafers for integrated circuits, MEMS, micro-optic and microfluidic devices, sensors, holograms and security features on banknotes and ID cards.

    The Professional Grayscale Lithography Mode enables patterning of complex 2.5D structures in thick photoresist over large areas. With a minimum feature size of 500 nm, a write area of 400 mm x 400 mm and optional automatic loading system, the DWL 4000 GS systems is particularly suitable for wafer-level micro-optics used for telecommunications, illumination and industrial display manufacturing.

  • VPG 300 DI | MASKLESS STEPPER
    The VPG 300 DI Maskless Stepper is a Volume Pattern Generator specifically designed for direct writing of high-accuracy and high-resolution microstructures in i-line resists, for use in academic and industrial R&D, or low-volume production....

    • VPG 300 DI Maskless Stepper

    The maskless direct imager VPG 300 DI for high accuracy and high-resolution microstructures. The VPG 300 DI is a Volume Pattern Generator specially designed for direct writing high-resolution microstructures in i-line resists. Derived from the mask making tool, it features all advanced VPG+ system components to be able to write with the highest precision and accuracy. The maximum write area covers a 300 mm wafer.

  • ULTRA | SEMICONDUCTOR MASK WRITER
    The ULTRA is designed to create photomasks for fabricating a wide range of electronic devices, including microcontrollers, power management systems, LEDs, Internet of Things (IoT) devices, MEMS, and cutting-edge Artificial Intelligence (AI) applications....

    • ULTRA Semiconductor Mask Writer

    The ULTRA Semiconductor Mask Writer is an economical mask writer solution with all the features and functionality required for high throughput, precision and structure uniformity, and extremely accurate alignment. The standard configuration includes features like full automatic mask handling, Zerodur® stage, low distortion optics and high-precision position control.
    ULTRA systems can produce structure sizes down to 500 nm at write speeds up to 580 mm2 per minute, while featuring excellent critical dimension uniformity, image quality, overlay and registration. As a compact system, it fits easily into the existing mask shop infrastructure.

    Key advantages of the ULTRA include:

    • Cost-Effective Solution with High Precision and Accuracy: The ULTRA can produce structure sizes as small as 500 nm while maintaining excellent critical dimension uniformity and superior image quality.
    • Efficient Production: With write speeds of up to 580 mm² per minute, the ULTRA ensures efficient and reliable mask production.
    • Seamless Integration: Its compact design allows easy integration into existing mask shop infrastructures, making it an ideal choice for semiconductor manufacturers looking to expand or upgrade their capabilities.
    • Advanced Features: The standard configuration includes fully automatic mask handling, a Zerodur® stage, low distortion optics, and high-precision position control, ensuring top-level performance and reliability.

Categories

200 Packaging and Assembly Equipment
  • Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners
    • 204 MEMS Equipment
  • Double sided mask aligner
    • 205 Nanotechnology Equipment and Tools
  • Equipment, Nanotechnology Tools
    • 207 Process Equipment
  • Lithography; Exposure; Aligners; Direct Write Systems; Steppers; Scanners; Nanoimprint
    • 700 Manufacturing Services
  • Lithography; Patterning service

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