Osiris International GmbH

AUTOMATIC MICRO-ELECTRONICS CLUSTER SYSTEM

The OSIRIS system platform offers the customer the possibility to configure the system so that it can be optimally equipped for the required process.
This VARIXX 804 automatic cluster system can be equipped with spin or spray coat and developer process modules, HMDS (vapor primer),
hotplates and cool-plates for wafer sizes Ø2" /50mm up to Ø8" /200mm or square substrates up to 6” x 6” / 150 x 150 mm.

One precise and fast running robotic are able to handle very thin fragile substrates very gently. With our system control unit via a 22" touchscreen display is used for optimum control and monitoring of the machine.

BENEFITS

•   Substrate sizes up to 200mm (round) or 6"x 6" (square)
•   Flexible configuration of process modules
•   Dual arm robotic system for increasing throughput
•   On-the-fly product alignment
•   Full edge handling (backside protected) or standard vacuum gripping
•   Handling for thin, standard or bonded wafer (Si, glass & others)
•   SECS/GEM interface
•   Standard and customized chuck design

SEMI-AUTOMATED SPIN COATER SYSTEM FOR LARGE SUBSTRATES.

The Osiris UNIXX S 760+ combined with CCP (Covered Chuck Processor) technology and the smart inlays solution to eliminate the thermal effect.
The system achieves the best uniform layer on the substrate up to the edge.

BENEFITS

- Substrate sizes up to 21” x 21” (537mm x 537mm) or round up to 760mm
- One process spin bowl with CCP (Covered Chuck Processor)
- Transport trolley for manual load/unloading
- Motorized dispense arm
- Clear and easy to operate user interface
- Unlimited numbers of flow and station recipe
- Easy access to the modules for maintenance, cleaning and service
- Latest technology in automatic gas flow control
- Optional subsystems; PR dispensing systems and media supply cabinets for vorious chemicals.