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Grintimate Precision Industry Co., Ltd.

No. 23, Gongyequ 36th Rd., Xitun Dist.
Taichung City,  Taichung City  407

Taiwan
https://www.grintimate.com/
  • Booth: C1215


Welcome & discover GRINTIMATE's advanced grinding solutions!

GRINTIMATE is a leading Taiwanese manufacturer specializing in advanced wafer grinding and thinning solutions for the semiconductor industry. Established with a commitment to precision, innovation, and reliability, we design, develop, and produce high-performance grinding machine that meets the stringent requirements of semiconductor fabrication. 

Our wafer grinders integrate cutting-edge technologies, including hydrostatic bearings, ultrasonic-assisted spindles, AI-driven process monitoring, and high-precision measurement systems, ensuring exceptional wafer quality, consistency, and efficiency. With continuous R&D and collaboration with upstream and downstream partners, GRINTIMATE delivers customized, automated, and smart manufacturing solutions. 


We are dedicated to empowering semiconductor manufacturers worldwide, driving technological advancement, and promoting sustainable production practices. Experience the future of precision manufacturing with GRINTIMATE! 

 Press Releases

  • GRINTIMATE proudly introduces the GTR-2386, a hydrostatic ultrasonic dual-spindle wafer grinding and thinning machine designed for third-generation semiconductors such as SiC and other 
    high-precision applications. Its dual-spindle independent control architecture enables simultaneous rough and fine grinding while flexibly handling wafers of different materials, thicknesses, and sizes. The GTR-2386 features hydrostatic bearings for non-contact, 
    high-rigidity, and long-lasting performance. Its ultrasonic-assisted spindles reduce wheel clogging and wafer stress, improving surface finish. The AI-powered process monitoring system, integrated with multi-sensor feedback, spindle current monitoring, and real-time thickness compensation, ensures precise wafer thickness control while minimizing material loss. 
    The machine also supports multi-wafer processing and 
    high-throughput automation, with programmable workflows and full-process data recording, significantly enhancing process consistency, efficiency, and reliability. GRINTIMATE continues to integrate advanced technologies with intelligent process management to empower semiconductor manufacturers with precise, smart, and high-performance solutions. 
    GRINTIMATE specializes in the R&D, design, and manufacturing of semiconductor wafer grinding machines. Leveraging hydrostatic bearings, ultrasonic-assisted spindles, and AI smart monitoring, GRINTIMATE delivers high-precision, reliable, and efficient solutions to meet the demands of semiconductor manufacturers worldwide. 

 Products

  • Dual Spindles Hydrostatic Wafer Grinder
    The GTR-2386 by GRINTIMATE is a cutting-edge wafer grinding machine for semiconductors. Featuring hydrostatic bearings, ultrasonic-assisted spindles, and AI smart monitoring, it ensures ultra-precise, consistent, and efficient processing....

    • (1) Hydrostatic Bearing System
    Non-contact operation provides extremely high rigidity and stability, effectively preventing vibration-induced surface defects. Ideal for processing brittle materials. 
    (2) Low-Stress Processing Technology
    Reduces micro-cracks and internal stress generated during wafer processing, improving yield and reliability. 
    (3) Smart Monitoring and AI Diagnostic Functions
    Real-time feedback system monitors spindle condition, load pressure, and grinding wheel rack status to prevent wafer cracks and detect abnormal wafer quality conditions, improving equipment uptime. 
    (4) Customization Capability
    Chuck sizes can be customized according to customer requirements, supporting thinning processes for semiconductor materials of various sizes. 
    (5) Multi-worktable Design
    The multi-worktable design allows users to process wafers of different materials and thicknesses, as well as perform rough and fine grinding simultaneously. This enhances application flexibility. 

Categories

200 Packaging and Assembly Equipment
  • Backgrind; Slicing; Lapping; Polishing Equipment
    • 700 Manufacturing Services
  • Sawing; Lapping; Grinding; Polishing Service

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