The 5-axis wafer inspection stage is designed for next-generation optical and e-beam wafer inspection and metrology. Supporting 200 and 300 mm wafers, it offers travel in X, Y, Z, and Theta with high accuracy and stability under the objective. The integrated XY2Z-Theta design eliminates stacked systems, improving dynamic performance and reducing Abbe errors. With lightweight construction, a granite base, and all drive dynamics aligned in one plane, the stage achieves high acceleration (20 m/s²), <1.5 μm accuracy, and short settling times for maximum throughput. Thermal management solutions ensure stability, while the compact 2Z-Theta module combines fine and coarse Z-axes with gravity compensation and a precision Theta axis for smoothness and rigidity. Features include three vacuum lines for fast wafer handling. Its modular design allows customisation to meet specific application requirements in semiconductor inspection and metrology.