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Microcontrol Electronic SRL

Via Giuba 11
Milano,  I-20132

Italy
http://www.microcontrol.org
  • Booth: B1251


Come, visit, challenge us to meet your requirements!

Microcontrol Electronic srl has its headquarter in Milan - ITALY , and subsidiary offices in Roma and Catania. Founded in 1976 with the mission of servicing the Italian semiconductor market. In 1985 it started designing and manufacturing its own product line.  Microcontrol is now a  leading supplier of equipment and service for the worldwide microelectronic industry , its portfolio includes lamination, UV curing and handling systems, counting  more than 800 units installed in 20 different countries, continuoulsy supported by the technical service group. Microcontrol is renowned for the flexibility and reliability of its tools, and always committed to accept any new challenge of the semiconductor industry.  

 Products

  • Leonardo
    Microcontrol Electronic products portfolio has always been driven by customers' requests, for either equipment not yet on the market, or for customizations of our existing equipment ...

    • Microcontrol Electronic Leonardo platforms:

    DR series: Lamination system to apply photolithographic resist film

    BG series: BG tape lamination and delamination systems

    DLO series: Fully automatic Dry Metal Lift Off system

    TK series: Taiko wafers delamination system

    FM series: Fully automatic Frame Mounter system

    LD series: Fully automatic system, it combines lamination and delamination processes in a single tool

    UVC series: Fully automatic UV curing system

  • Dry Metal Lift Off
    AUTOMATIC extra metal removal without solvent use...

    • AUTOMATIC extra metal removal wihtout solvent us
  • Dry Metal Lift Off
    UTOMATIC extra metal removal without solvent use...

    • New method to lift off metal with adhesive tape from wafer.

    Rmove in only one process step metal sanwich such as Ti-Au -Ti or Au or Au - Ti etc

    Microcontrol Electronic offers Leonardo 200 Lift Off System on the market giving the following benefits :

    - This method allows the customer to choose solvent free process

    - Even using solvent ther won't be the need to destroy metal layer to reach photoresist

    - Easier aand more environmental friendly method to recycle precious metal waste 

Categories

200 Packaging and Assembly Equipment
  • Backgrind; Slicing; Lapping; Polishing Equipment
  • Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners
  • Wafer Mount; Taping Equipment
    • 202 Other Equipment
  • Lamination; Sheet Laminating Equipment
    • 204 MEMS Equipment
  • Wafer Level Bonders
    • 207 Process Equipment
  • Bumping Systems
  • Coat; Develop; Resist Processing; Track Equipment
  • Etching; Stripping; Ashing - Dry and Wet Equipment
  • Transfer Systems for Wafer; Reticles or FPD's
    • 400 Components, Parts & Accessories
  • Lamps (non Lithography), all type UV; LED and other
    • 401 Sub-systems
  • Handling; Transfer; Loading Systems; Lifting devices
    • 502 Material Handling Systems
  • Robotics; Transfer Systems
    • 701 Manufacturing Services or Consulting
  • Wafer Handling

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