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Nova Ltd.

5 David Fikes St.
Rehovot,  7632805

Israel
https://www.novami.com/
  • Booth: C1419


The Future of Process Insight, today.

Nova Ltd. is a leading innovator and key provider of materialdimensional, and chemical metrology solutions for advanced process control in semiconductor manufacturing.

Nova delivers continuous innovation by providing state-of-the-art high-performance metrology solutions for Logic, Memory, Advanced Packaging, and Specialty Devices throughout the fabrication lifecycle.

Nova’s product portfolio, which combines high-precision hardware and cutting-edge software, provides its customers with deep insight into developing and producing the most advanced semiconductor devices. Nova’s unique capability to deliver innovative solutions enables its customers to improve performance, enhance product yields, and accelerate time to market. Nova acts as a partner to semiconductor manufacturers from its offices worldwide.

Nova develops its solutions through R&D centers in Israel, Germany, and the USA. Nova serves its customer base through dedicated customer operations and service centers around the world. 


 Press Releases

  • Rehovot, Israel – August 26, 2025 – Nova (Nasdaq: NVMI), today announced the release of its latest optical metrology solution, the Nova WMC. This next-generation modular platform has been specifically designed to address the complex requirements of the most advanced packaging applications in semiconductor manufacturing.

    The Nova WMC represents a breakthrough in optical metrology, designed from the ground up as a completely new proprietary system. This platform stands out for its exceptional versatility, enabling it to seamlessly handle a wide range of wafer sizes and forms – including traditional and framed wafers—while supporting multiple metrology technologies in a modular manner. Thanks to this adaptability, WMC is well-positioned to meet the evolving needs of 2.5D and 3D advanced packaging processes and is uniquely equipped to deliver robust solutions for significant industry inflection points, such as hybrid bonding. With its comprehensive capabilities, WMC empowers manufacturers to solve emerging challenges, cementing its potential as a cornerstone tool for next-generation packaging applications.

    The platform has already been adopted by one of the world’s leading memory manufacturers for High Bandwidth Memory, and several additional orders have been placed by manufacturers of logic, advanced memory, and power devices. The strong demand for Nova WMC stems from the platform’s unique ability to address major challenges such as high warpage, non-symmetric shapes, and different surface conditions in a single tool, with high throughput, and fast, repeatable scanning with large-area mapping at nanometer fidelity. The company has already recognized revenue for the first system and received orders for multiple systems, for which it expects to recognize revenue by the end of 2025.  

    “We are excited to introduce the Nova WMC to our customers,” said Gaby Waisman, President and CEO of Nova Ltd. “This innovative platform provides manufacturers with the precision and flexibility they need to stay ahead in rapidly evolving advanced packaging manufacturing processes. The Nova WMC is a testament to our commitment to deliver cutting-edge solutions that seamlessly adapt to evolving process demands.”

  • Rehovot, Israel, October 6, 2025 – Nova (Nasdaq: NVMI) today announced that its ELIPSON® materials metrology solution has been selected as Tool of Record by a leading global foundry customer for advanced Gate-All-Around (GAA) manufacturing processes. The  Company has received orders and delivered several ELIPSON® tools to the customer for use in various high-volume production processes. 

    The selection marks a significant milestone for the ELIPSON® platform, which is designed to deliver non-destructive, in-die material characterization for the most challenging nodes in semiconductor fabrication. This selection joins the recent adoption of the Nova Metrion® platform by another GAA customer, further expanding the presence of Nova’s materials metrology solutions in advanced logic nodes production.

    Nova ELIPSON® leverages state-of-the-art Raman spectroscopy technology to provide precise, repeatable measurements of material properties—key requirements for next-generation device architectures. By enabling rapid, non-contact material analysis at the nanoscale, ELIPSON® supports manufacturers’ needs for both innovation and efficiency in a dynamic market landscape.

    Gaby Waisman, President and CEO of Nova, commented: “The selection of ELIPSON® by a leading global foundry for Gate-all-Around manufacturing, underscores our commitment to delivering differentiated solutions for the evolving needs of our customers. These latest developments indicate the significant value of our materials metrology portfolio to the industry’s need for critical process insight in advanced nodes production.”

  • Rehovot, Israel, March 18, 2025 - Nova (Nasdaq: NVMI) today announced that its co-authored paper with Samsung Electronics on “On-Cell Thickness Monitoring of Chalcogenide Alloy Layer using Spectral Interferometry, Raman Spectroscopy, and Hybrid Machine Learning” has been selected as the winner of the Vladimir Ukraintsev Award for “Collaborations in Metrology” at SPIE’s 2024 Advanced Lithography + Patterning Conference.  
     
    The award was granted to Nova and Samsung on the opening day of the 2025 conference. The paper is a result of continuous collaboration between the companies to explore innovative approaches to metrology in advanced chip manufacturing. The paper demonstrates the application of Nova’s novel technologies in advanced process control by utilizing its unique and differentiated solutions.  
     
    The thickness of the chalcogenide Ovonic Threshold Switching (OTS) layer is one of the most critical parameters  for  the  Selector-Only  Memory  (SOM)  process  control.  In  this  work,  we  successfully demonstrated an alternative approach to enable precise monitoring and control of the chalcogenide layer using hybrid metrology consisting of Spectral Interferometry, Raman Spectroscopy and Machine Learning algorithms. The paper details how these advanced techniques were applied to achieve accurate thickness monitoring, ensuring optimal performance and reliability of SOM devices. 
     
    “We are honored to receive this prestigious award in collaboration with Samsung Electronics,” said Dr.Shay Wolfling, Chief Technology Officer of Nova. "This collaboration showcases Nova's capability to leverage  its  unique  innovative  technologies,  facilitating  process  control  in  the  most  advanced semiconductor devices. We continue to expand our solutions and enhance synergies within our portfolio, in  collaboration  with  our  leading  customers,  to  address  the  growing  challenges  in  advanced  node manufacturing.”    
     
     
     
     
    About Nova 
    Nova is a leading innovator and key provider of material, optical and chemical metrology solutions for advanced  process  control  in  semiconductor  manufacturing.  Nova  delivers  continuous  innovation  by providing state-of-the-art, high-performance metrology solutions for effective process control throughout the semiconductor fabrication lifecycle. Nova’s product portfolio, which combines high-precision hardware  and  cutting-edge  software,  provides  its  customers  with  deep  insight  into  developing  and producing  the  most advanced semiconductor devices. Nova’s unique capability to deliver innovativesolutions enables its customers to improve performance, enhance product yields, and accelerate time to market. Nova acts as a partner to semiconductor manufacturers  from its offices worldwide. Additional information may be found on Nova’s website link - https://www.novami.com/.  
     
    Nova is traded on the Nasdaq and TASE, Nasdaq ticker symbol NVMI. 
     
    Forward-Looking Statements This press release contains forward-looking statements within the meaning of safe harbor provisions of  the Private Securities Litigation Reform Act of 1995 relating to future events or our future performance, such as statements regarding, but not limited to, anticipated growth opportunities and projections about our  business  and  its  future  revenues,  expenses  and  profitability.  Forward-looking  statements  involve known and unknown risks, uncertainties and  other  factors  that may cause  our  actual  results,  levels  of activity, performance  or  achievements  to  differ  materially  from  any  future  results,  levels  of  activity, performance or achievements expressed or implied in those forward-looking statements. Factors that may affect our  results,  performance,  circumstances  or  achievements  include,  but  are  not  limited  to,  the following:    risks  related  to  information technology security  threats, sophisticated computer crime, and data  privacy;  foreign  political  and  economic  risks  including  supply-chain  difficulties;  regulations  that could restrict our operations such as economic sanctions and export restrictions; changes  in U.S. trade policies  and  taxation;  indirect  effects  of  the  Russia  –  Ukraine  conflict;  market  instability  including inflation  and  recessionary  pressures;  risks  related  to  doing  business  with  China;  catastrophic  events; inability to protect our intellectual property; open source technology exposure, including risks related to artificial intelligence; risks related to the use of artificial intelligence technologies; challenges related to our  new  ERP  system;  failure  to  compete  effectively  or  to  respond  to  rapid  technological  changes; consolidation in our industry; difficulty in predicting the length and strength of any downturn or expansion period of the market we target; factors that adversely affect the pricing and demand for our product lines; dependency on a small number  of  large customers; dependency on a  single manufacturing  facility per product  line;  dependency  on  a  limited number  of  suppliers;  difficulty  in  integrating  current  or  future acquisitions;  lengthy  sales  cycle  and  customer  delays  in  orders;  risks  related  to  conditions  in  Israel, including Israel’s conflicts with Hamas and other parties in the region; risks related to our convertiblenotes;  currency  fluctuations;  and  quarterly  fluctuations  in  our  operating  results. We  cannot  guarantee future results, levels of activity, performance or achievements. The matters discussed in this press release also  involve  risks  and  uncertainties  summarized  under  the  heading  "Risk  Factors"  in Nova's  Annual Report  on Form 20-F  for  the year  ended December  31,  2024,  filed  with  the Securities  and Exchange Commission on February  20,  2025. These  factors are updated  from time to  time through  the  filing  of reports and registration statements with the Securities and Exchange Commission. Nova Ltd. does not assume any obligation to update the forward-looking information contained in this press release. 

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