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Microtest

Via della Galeotta 9A
Altopascio (LU),  I-55011

Italy
https://www.microtest.net
  • Booth: C1543


Welcome to Microtest page! Looking for a testing partner?

The Microtest Group offers testing products and services for the semiconductor ecosystem

The Microtest Group operates in the semiconductor eco-system, providing best-in-class ATE, Test Services, and ASIC design for the automotive, industrial, power, sensor and healthcare markets. Microtest is the ideal company to optimize business operations and reduce testing costs; leveraging 25 years of advanced performance, high parallelism, and pioneering automation. The Microtest Group is headquartered in Europe, Italy with support globally, and remains committed to innovation, service, and quality. www.microtest.net



 Products

  • Vip Ultra
    New-gen, high-throughput ATE configurable for complex smart power devices, SiC, and GaN power discrete products ...

  • New-gen Automatic Test Equipment configurable for Si, SiC and GaN power products; high side and low side Driver ICs, IGBT, Power MOSFETs, Power ICs.

    The VIP Ultra by Microtest is a next-generation, high-throughput ATE (Automatic Test Equipment) engineered for power-semiconductor testing—ideal for Si, SiC, GaN discrete devices, power modules, and high-/low-side driver ICs.
    Designed for cleanroom integration, it delivers exceptional parallel performance metrics, scaling from 48 sites at 80 V and 250 A to 16 sites at 4 kV and 250 A, ensuring ultra-high throughput with minimal footprint and low total cost of ownership.
    Its versatile configurations include DCS sources (±80 V, ±4 A across up to 48 channels), programmable DC load sinks/sources (±250 A on 48 channels), 320 digital lines (0–5.5 V, 50 mA with DSIO memory and per-channel PPMU), 48 time-measurement units, 48 LCR meters, 64 PPMUs, and Picoammeter accuracy down to 20 pA.
    These resources enable a comprehensive suite of DC and energy-stress test capabilities.
    Measuring 647 × 638 × 702 mm, VIP Ultra’s compact form fits seamlessly within existing probers and handlers. Launched at APEC 2025, it has been recognized as “Product of the Month” by Bodo’s Power Systems, solidifying its status as a leading solution for wide-bandgap semiconductor testing.
    In summary, VIP Ultra combines unmatched scalability, compact design, and exhaustive test functionality across all power-device categories—offering manufacturers a superior tool for maximizing throughput, efficiency, and confidence in WBG technologies.

  • DMT EVO
    Low-cost, mixed signal, test development ATE system...


  • The DMT from Microtest is a compact, mixed‑signal and digital automatic test equipment (ATE) designed for efficient IC validation. Thanks to its ultra‑high hardware integration, it delivers more resources than larger testers while occupying the lowest footprint on the market.

    A key feature is Kronos, an intelligent software toolset that automatically converts test descriptions into optimized test code, drastically cutting development time and accelerating time‑to‑market—new ICs can be validated in just a few weeks.
    The system supports up to five slots with flexible configurations.
    Each slot offers:
    DC sources: low‑power (±110 V, ±200 mA), medium‑power (±110 V, ±4 A), and floating high‑power (±80 V, ±10 A)
    Digital I/O: up to 256 channels per slot (−1.25 V to 6.75 V, 50 mA drive, active load ±12 mA), with 64 M pattern memory and 32 M DSIO
    Time‑measurement unit & differential metering (up to 32 mux4) plus AWG & digitizer (up to 16 per slot).

    Measuring just 230 mm × 350 mm × 500 mm, the DMT excels in lab or pre‑production environments where space is tight, resources must be dense, and testing must be fast and modular.

  • Hatina GP
    The HATINA GP is designed for testing complex Smart Power ICs and SoCs. Recommended for high parallelism...

  • HATINA GP is a general-purpose ATE system developed by Microtest for high-parallelism testing of ASICs, PMICs, and Smart Power ICs/SoCs.
    Designed for both wafer-level and packaged device applications, the system integrates modular resources for DC testing, digital signals, and complex measurements. Its intelligent resource management maximizes efficiency and reduces test costs.Thanks to built-in multiplexers, HATINA GP simplifies load board design, enhancing reliability and minimizing footprint. The architecture supports up to 10 configurable slots.
    Per-slot resources include digital channels up to 800 MHz, high-current DPS, precision measurements with 20 pA resolution, and advanced instruments such as AWG, LCR meter, and digitizer.The system is compact, energy-efficient, and easily integrable into automated production environments.
    Kronos software enables rapid, automated development of test programs, optimizing time-to-market.

    HATINA GP is an ideal solution for production environments that demand flexibility, scalability, and high performance, particularly in the automotive, industrial, and smart power sectors.

  • Hatina WLBI
    Solution for wafer level Burn-In​ for power MOS...

  • The Hatina WLBI by Microtest is a robust wafer-level Burn-In and HTOL (High-Temperature Operating Life) solution designed specifically for power devices on wafers. This compact test chamber (560×560×550 mm) plugs into standard wafer probers, enabling full-wafer Burn-In without major equipment overhauls.
    Its high parallel throughput supports 1,600 test sites simultaneously, each operating at up to 1.2 kV and 2 mA—ideal for lifecycle and reliability testing of power technologies.
    The WLBI seamlessly integrates functional burn-in, HTGB (High-Temperature Gate Bias), and HTRB (High-Temperature Reverse Bias) test setups, offering a flexible and cost-effective package.
    Compact and easy to handle, the WLBI is engineered for cleanroom use and aligns with Microtest’s ovenless Burn-In philosophy—embedding heaters directly at each DUT for precise, low‑power thermal control.
    This design reduces energy use, lowers footprint, and simplifies automation compatibility.
    In summary, the Hatina WLBI is a high-density, wafer-level Burn-In platform that delivers full-wafer reliability testing for advanced power semiconductors, combining high voltage, tight temperature control, and multi-site scalability in a compact, integration-friendly format—perfect for enhancing manufacturing efficiency and device confidence.
  • Ovenless Burn-In & HTOL solution
    AUTONOMOUS CONTROL OF THE DUT HEATER TO MINIMIZE ENERGY CONSUMPTION The Microtest Ovenless Burn-In is a powerful and innovative solution for Burn-in, that allows the maximum flexibility to match your needs....

  • The Ovenless Burn‑In & HTOL Solution from Microtest offers a groundbreaking, eco-friendly alternative to traditional burn-in ovens. Designed for high-density device testing, it delivers per‑DUT independent thermal control without ovens, dramatically reducing energy usage, cooling requirements, and facility footprint.
    This rack-based platform includes a Burn-In System (BIS) and racks with 24 internal slots, each slot accommodating up to 120 devices—enabling fully automated, large-scale burn-in and HTOL cycles. The system achieves faster temperature ramp-up/cool-down and precise thermal regulation at the DUT level—significantly improving test efficiency and uniformity.
    Its green credentials are impressive, with lower power consumption and a reduced carbon footprint, aligning with ESG and Industry 4.0 initiatives.
    Measuring approximately 2000 mm (H) × 1200 mm (W) × 1300 mm (D), this solution is SECS‑GEM compliant and cleanroom-ready, easily integrating into existing production lines. Its versatile application spans across sectors—from automotive, medical, MEMS and consumer electronics to aerospace, defence, industrial, and power semiconductors.
    In summary, the Ovenless Burn‑In & HTOL Solution combines cutting-edge thermal management, sustainable operation, and high-throughput automation—providing manufacturers with a smarter, cleaner, and more efficient platform for reliability testing of semiconductor devices.

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