Heidelberg Instruments Mikrotechnik GmbH

VPG+ 1400 FPD / VPG+ 1850 Volume Pattern Generator | Heidelberg Instruments

Engineered for photomask production on substrates up to G8.6 (1400 × 1800 mm²), the VPG+ 1400/1850 FPD delivers exceptional throughput, 1.2 nm alignment precision, and Mura optimization. Ideal for TFT arrays, color filters, and ITO electrodes in high-volume FPD manufacturing. Reliable 24/7 operation ensures consistent quality and delivery.

Key Benefits

• Optimized for FPD Manufacturing: Tailored for TFT arrays, color filters, and ITO electrodes.
• Exceptional Throughput: Accelerates photomask production for high-volume display lines.
• Reliable 24/7 Operation: Ensures consistent performance and predictable delivery.
• 1.2 nm Alignment Precision: Uses differential interferometry for ultra-accurate patterning.
• Mura Optimization: Achieves excellent CD uniformity and resolution across large areas.
• Closed-Loop Environmental Chamber: Maintains thermal and particle stability for high-quality results.
• Advanced Metrology: Enables precise second-layer alignment and greytone mask production.

VPG 300 DI Maskless Stepper | Heidelberg Instruments

VPG 300 DI – The Power of a Stepper, The Freedom of Direct Write

The VPG 300 DI bridges the gap between R&D and production, offering sub-micron resolution and tight overlay accuracy comparable to traditional i-line steppers—without the cost and delays of mask procurement. Ideal for rapid prototyping, process development, and applications requiring frequent design iterations. From CAD to exposure in minutes, the system enables fast design transfer and daily iteration cycles, dramatically accelerating development timelines.

Key Benefits

• High-Speed Exposure: Custom SLM and optimized data path enable 100×100 mm² writing in just 9 minutes
• Stitching-Free Large Areas: Create large dies or devices without stitching errors
• Instant Design Changes: Modify CAD files and expose immediately—no mask handling required

ULTRA Semiconductor Mask Writer | Heidelberg Instruments

The ULTRA integrates state-of-the-art technology to address the primary concerns of modern mask shops: speed, accuracy, and return on investment.

The system’s advanced exposure engine and optimized write modes dramatically reduce mask writing times, enabling you to produce a standard 6” photomask in less than 45 minutes.

• Fast SLM-based Exposure Engine: Delivers write speeds up to 580 mm²/minute without compromising quality.
• Full Automatic Mask Handling: Reduces operator overhead with a simple, easy-to-use mask loading interface and ensures consistent, repeatable loading and unloading for continuous operation.
• Optimized Write Modes: Provides the flexibility to prioritize speed or resolution to match your specific job requirements.

MLA 300 Industrial Maskless Aligner ǀ Heidelberg Instruments

The MLA 300 Maskless Aligner enables innovative solutions for complex lithography challenges, including advanced packaging, sensor calibration, and MEMS fabrication. With high throughput, 1.5 μm resolution, a simplified workflow, and seamless MES integration, it is the ideal choice for a wide range of industrial applications. 

Application areas include semiconductors and advanced packaging, sensor and sensor ICs, MEMS and microfluidics, discrete components, integrated circuits and ASICs, probe cards, power electronics, and OLED displays.

Key Features

• High-Throughput Production: Optimized for industrial-scale production with a minimum feature size of 1.5 µm. For higher volume requirements, we also offer a high-throughput write mode with 3 µm minimum feature size.
• Advanced Precision: This system offers the highest optical quality, ensuring precise and accurate patterning across a wide range of challenging substrates.
• Full Automation: The MLA 300 features full automation, including customizable loading options, advanced software designed for production environments, and integration with MES systems.
• Patented Substrate Tracking Technology: Real-time autofocus compensates for substrate warp or corrugations, guaranteeing flawless patterning and uniformity on all surfaces.

DWL 4000 GS Grayscale Tool

The DWL 4000 GS laser lithography systems is a fast and flexible high-resolution pattern generator, optimized for industrial-level grayscale lithography and designed for high-throughput patterning of masks and wafers for integrated circuits, MEMS, micro-optic and microfluidic devices, sensors, holograms and security features on banknotes and ID cards.

The Professional Grayscale Lithography Mode enables patterning of complex 2.5D structures in thick photoresist over large areas. With a minimum feature size of 500 nm, a write area of up to 400 x 400 mm2 and optional automatic loading system, the DWL 2000 GS / DWL 4000 GS systems are particularly suitable for wafer-level micro-optics used for telecommunications, illumination, and industrial display manufacturing, as well as for device fabrication in life sciences.

Product highlights

• Exposure Quality: CD uniformity 60 nm; edge roughness 40 nm; alignment accuracy 60 nm; 2nd layer alignment 250 nm; autofocus compensation 80 µm
• Grayscale Lithography: 1024 gray levels; dedicated GenISys BEAMER software for optimizing the exposure of complex geometries
• Temperature-controlled Flow Box: Temperature stability ± 0.1°, ISO 4 environment
• Exposure Speed: Area of 200 x 200 mm2 in grayscale mode in <60 minutes
• Large Substrate Size: Up to 20 / 40 cm

DWL 66⁺ Ultimate Lithography System ǀ Heidelberg Instruments

The DWL 66+ is a high-performance direct-write laser lithography system engineered for R&D and rapid prototyping across a wide range of microstructure applications, including MEMS, microfluidics, optics, photonics, and quantum devices.

It delivers the highest resolution on the market (down to 200 nm), professional-grade grayscale capabilities with 65,536 levels, and unmatched versatility through a fully customizable system configuration. With over 400 systems installed worldwide, it’s a proven solution for advanced research environments.

Key Features

• Write Mode XR: Achieve 200 nm minimum feature size with exceptional speed and quality.
• Grayscale Lithography: Outstanding surface quality in thick resists up to 150 µm.
• Flexible Substrate Handling: Compatible with diverse materials, shapes, and sizes—including curved surfaces.
• Real-Time Autofocus: Dual autofocus system ensures precision even on transparent or low-reflectivity substrates.
• Interferometric Position Control: Guarantees high pattern fidelity and placement accuracy.