Heidelberg Instruments Mikrotechnik GmbH

Mittelgewannweg 27
Heidelberg, 69123

Germany
https://heidelberg-instruments.com/

Booth: B1235

Experience the power of direct writing

With over 40 years of experience and 1,500+ systems installed worldwide, Heidelberg Instruments is a global leader in high-precision laser lithography systems, maskless aligners, and nanofabrication tools. Our portfolio spans from compact tabletop solutions for prototyping, R&D, and small series production to advanced photomask manufacturing equipment for high-volume industrial use. This broad offering enables support for a wide spectrum of micro- and nanoscale surface structuring techniques, including 2D patterning and 2.5D features via grayscale lithography. Trusted by leading universities, research institutes, and industrial facilities, our systems are used in micro-optics, photonics, electronics, sensors, semiconductors, advanced packaging, next-gen displays, quantum devices, MEMS, microfluidics, 2D materials, photomask production, and more.

Press Releases

Heidelberg Instruments Enhances DWL 66+ Lithography System, Achieving Market-Leading 200 nm Resolution and 65,536 Grayscale Levels (20250915)

Heidelberg, Germany – Heidelberg Instruments has made significant performance upgrades to its renowned DWL 66⁺ direct-write lithography system, solidifying its position as the ultimate research tool for microfabrication. The system now delivers a market-leading minimum feature size of 200 nm and advanced grayscale capabilities with 65,536 levels, empowering researchers to push the boundaries of innovation in different dimensions.

The new High-Resolution Mode, Write Mode XR, achieves an unsurpassed combination of resolution, quality, and speed. Its 200 nm minimum feature capability allows for the fabrication of highly complex micro- and nanostructures, enabling applications in quantum devices, optics, and photonics that previously required more time-consuming e-beam lithography. This advancement accelerates development cycles and frees up cost-intensive e-beam systems for their most demanding tasks.

Complementing the high resolution is the system's professional-grade grayscale lithography. With an unprecedented 65,536 intensity levels, the DWL 66⁺ can create intricate 2.5D microstructures, such as micro-lenses and other micro-optical devices, with outstanding surface smoothness in photoresists up to 150 µm thick.

With 30 years of continuous development and over 400 units installed, the DWL 66⁺ is a proven, robust, and extremely flexible platform for R&D and rapid prototyping. These latest enhancements reinforce its value, offering users a powerful combination of extreme resolution and operational flexibility.

For more information on the DWL 66⁺ lithography system, please visit: https://heidelberg-instruments.com/product/dwl-66-laser-lithography-system/

Contact:

Sonja Pfeuffer, Head of Marketing & Communications

[email protected]

Further information
https://heidelberg-instruments.com/

About Heidelberg Instruments Mikrotechnik GmbH:

With over 40 years of experience and well over 1,500 systems installed in more than 50 countries, Heidelberg Instruments is a global leader in design, development and production of high-precision laser lithography systems, maskless aligners, and nanofabrication systems offering solutions from tabletop tools to high-end photomask manufacturing equipment. The versatile systems enable a broad spectrum of surface structuring on the micro- and nanoscale, including 2D-patterning and the creation of 2.5D features by Grayscale lithography. Due to their flexibility, the systems are valuable assets to leading universities and R&D institutes around the world, as well as to industrial production facilities. Typical fields of application include micro-optics and photonics, electronics and sensors, semiconductors and advanced packaging, next-generation display manufacturing, quantum devices, MEMS, microfluidics, 2D materials, photomask production, and many others.

A Decade of Discovery: Heidelberg Instruments’ MLA 150 Maskless Aligner Turns 10 (20251007)

Heidelberg, Germany —Heidelberg Instruments proudly celebrates the 10th anniversary of the MLA 150 Maskless Aligner—a breakthrough that has redefined high-resolution lithography in cleanrooms around the world. Since its launch in 2015, the MLA 150 has provided researchers and engineers with a flexible, mask-free alternative to traditional photolithography, transforming microfabrication across both academia and industry.

“The MLA 150 Maskless Aligner was created to address bottlenecks in multi-user cleanrooms caused by aging mask aligners and time-consuming photomask production. Heidelberg Instruments envisioned a direct-write solution with better performance than a mask aligner—without the delays. The result: fast turnaround, high accuracy, and exceptional ease of use”, states Steffen Diez, COO Heidelberg Instruments.

At the heart of the MLA 150 is a digital micromirror device (DMD), acting as a dynamic mask, paired with solid-state light sources and advanced alignment capabilities. This combination made the system a game-changer from day one. With exposure times under 10 minutes, full process cycles under 30 minutes, and user training completed in under an hour, the MLA 150 quickly set a new benchmark for R&D lithography. “The MLA 150 is one of the most consistently utilized tools in our cleanroom,” says Dr. Tom Peach, Senior Process Engineer at Cardiff University. “Its flexibility and ease of use have made it a cornerstone of our lithography workflows.” By enabling users to go from digital design to a perfectly patterned substrate in minutes, the MLA 150 empowers rapid innovation in fields such as quantum devices, MEMS, micro-optics, and life sciences.

Refined through close collaboration with leading institutions—including EPFL, the Kirchhoff Institute for Physics (KIP) at Heidelberg University, and the Harvard Center for Nanoscale Systems (CNS)—the MLA 150 quickly proved its value. At KIP, for example, it enabled a threefold increase in yield for complex SQUID (superconducting quantum interference device) sensor fabrication, demonstrating its transformative impact. While initially embraced by research labs, the system’s versatility and cost-efficiency soon attracted industrial users seeking agile solutions for rapid prototyping and small-series production. From foundational research in quantum materials to the development of life-saving biosensors, the MLA 150 has been a silent partner in countless discoveries.

In 2025, Heidelberg Instruments introduced a major upgrade to the MLA 150, pushing the minimum feature size to 450 nm and expanding its capabilities for high-precision applications.

Today, the MLA 150 is a trusted workhorse in more than 250 cleanrooms worldwide. As Heidelberg Instruments celebrates this milestone, it also honors the global community of users, engineers, and partners who have helped shape the MLA 150 into a transformative platform—one that continues to push the boundaries of what is possible in microfabrication.

Explore the history marking a decade of the MLA 150 and take part in the special contest celebrating its 10th anniversary.

Further information: https://heidelberg-instruments.com/mla-150-anniversary/

Contact:

Sonja Pfeuffer, press(at)heidelberg-instruments.com

https://heidelberg-instruments.com/

About Heidelberg Instruments

With over 40 years of experience and more than 1,500 systems installed across 50+ countries, Heidelberg Instruments is a global leader in the design, development, and production of high-precision laser lithography systems, maskless aligners, and nanofabrication tools. The product portfolio ranges from compact tabletop solutions to high-end photomask manufacturing equipment. This flexibility makes the systems indispensable to leading universities, R&D institutes, and industrial facilities worldwide. The versatile systems enable precise surface structuring on the micro- and nanoscale, supporting both 2D patterning and 2.5D features through grayscale lithography for applications in photonics and micro-optics, electronics, semiconductors, quantum technology, MEMS, microfluidics, 2D materials, and beyond.

Products

VPG+ 1400 FPD/VPG + 1850 VOLUME PATTERN GENERATORS

Designed for photomask production on large substrates in display applications, and tailored for the high-throughput patterning of large-area photomasks up to G8.6 size and a maximum exposure area of 1400 x 1800 mm².... More Info Less Info

VPG+ 1400 FPD / VPG+ 1850 Volume Pattern Generator | Heidelberg Instruments

Engineered for photomask production on substrates up to G8.6 (1400 × 1800 mm²), the VPG+ 1400/1850 FPD delivers exceptional throughput, 1.2 nm alignment precision, and Mura optimization. Ideal for TFT arrays, color filters, and ITO electrodes in high-volume FPD manufacturing. Reliable 24/7 operation ensures consistent quality and delivery.

Key Benefits

Optimized for FPD Manufacturing: Tailored for TFT arrays, color filters, and ITO electrodes.
Exceptional Throughput: Accelerates photomask production for high-volume display lines.
Reliable 24/7 Operation: Ensures consistent performance and predictable delivery.
1.2 nm Alignment Precision: Uses differential interferometry for ultra-accurate patterning.
Mura Optimization: Achieves excellent CD uniformity and resolution across large areas.
Closed-Loop Environmental Chamber: Maintains thermal and particle stability for high-quality results.
Advanced Metrology: Enables precise second-layer alignment and greytone mask production.

VPG 300 DI | MASKLESS STEPPER

Stepper-level performance with unmatched speed and flexibility for R&D, prototyping, and microfabrication: The VPG 300 DI is a high-performance direct-write lithography system for patterning high-resolution microstructures on wafers up to 300 mm.... More Info Less Info

VPG 300 DI Maskless Stepper | Heidelberg Instruments

VPG 300 DI – The Power of a Stepper, The Freedom of Direct Write

The VPG 300 DI bridges the gap between R&D and production, offering sub-micron resolution and tight overlay accuracy comparable to traditional i-line steppers—without the cost and delays of mask procurement. Ideal for rapid prototyping, process development, and applications requiring frequent design iterations. From CAD to exposure in minutes, the system enables fast design transfer and daily iteration cycles, dramatically accelerating development timelines.

Key Benefits

High-Speed Exposure: Custom SLM and optimized data path enable 100×100 mm² writing in just 9 minutes
Stitching-Free Large Areas: Create large dies or devices without stitching errors
Instant Design Changes: Modify CAD files and expose immediately—no mask handling required

ULTRA | SEMICONDUCTOR LASER MASK WRITER

The ULTRA delivers high-throughput, high-precision photomask writing for mature semiconductor nodes. A cost-effective solution for producing photomasks for microcontrollers, PMICs, LEDs, IoT, photonics, and MEMS—maximizing yield, speed, and reliability.... More Info Less Info

ULTRA Semiconductor Mask Writer | Heidelberg Instruments

The ULTRA integrates state-of-the-art technology to address the primary concerns of modern mask shops: speed, accuracy, and return on investment.

The system’s advanced exposure engine and optimized write modes dramatically reduce mask writing times, enabling you to produce a standard 6” photomask in less than 45 minutes.

Fast SLM-based Exposure Engine: Delivers write speeds up to 580 mm²/minute without compromising quality.
Full Automatic Mask Handling: Reduces operator overhead with a simple, easy-to-use mask loading interface and ensures consistent, repeatable loading and unloading for continuous operation.
Optimized Write Modes: Provides the flexibility to prioritize speed or resolution to match your specific job requirements.

MLA 300 | MASKLESS ALIGNER FOR VOLUME PRODUCTION

The MLA 300 is designed for high-volume production, offering unmatched flexibility and precision in industrial lithography. It supports wafers up to 300×300 mm and adapts to surface variations, eliminating costly, time-consuming mask production.... More Info Less Info

MLA 300 Industrial Maskless Aligner ǀ Heidelberg Instruments

The MLA 300 Maskless Aligner enables innovative solutions for complex lithography challenges, including advanced packaging, sensor calibration, and MEMS fabrication. With high throughput, 1.5 μm resolution, a simplified workflow, and seamless MES integration, it is the ideal choice for a wide range of industrial applications.

Application areas include semiconductors and advanced packaging, sensor and sensor ICs, MEMS and microfluidics, discrete components, integrated circuits and ASICs, probe cards, power electronics, and OLED displays.

Key Features

High-Throughput Production: Optimized for industrial-scale production with a minimum feature size of 1.5 µm. For higher volume requirements, we also offer a high-throughput write mode with 3 µm minimum feature size.
Advanced Precision: This system offers the highest optical quality, ensuring precise and accurate patterning across a wide range of challenging substrates.
Full Automation: The MLA 300 features full automation, including customizable loading options, advanced software designed for production environments, and integration with MES systems.
Patented Substrate Tracking Technology: Real-time autofocus compensates for substrate warp or corrugations, guaranteeing flawless patterning and uniformity on all surfaces.

MLA 150 | ADVANCED MASKLESS ALIGNER

The MLA 150 Maskless Aligner accelerates innovation with sub-micron lithography down to 0.45 μm, eliminating photomasks and long lead times. From design to substrate in minutes—fast, flexible, and easy to use. Ideal for R&D and industrial prototyping.... More Info Less Info

MLA 150 Advanced Maskless Aligner ǀ Heidelberg Instruments

Key Benefits

No Photomasks Required: Pattern directly from digital designs using a dynamic mirror device (DMD).
Fast Turnaround: Expose a full 150 mm wafer in under 16 minutes.
Sub-Micron Precision: Achieve feature sizes down to 0.45 μm.
User-Friendly Interface: Train new users in under an hour—ideal for shared lab environments.

Designed for R&D and Small Series Production, the MLA 150 is built for flexibility, making it the perfect tool for:

Academic Research Labs
Industrial Prototyping
Small Batch Manufacturing

Applications include quantum devices, MEMS, micro-optics, and life sciences.

Advanced Capabilities

Dual-Wavelength Exposure: Supports 375 nm and 405 nm lasers for compatibility with g-, h-, and i-line photoresists.
Versatile Substrate Handling: Easily process small pieces (down to 3×3 mm²), thin foils, and warped wafers.
Grayscale & High-Aspect-Ratio Modes: Create complex 2.5D structures and steep sidewalls for MEMS and microfluidics.
Interactive “Draw Mode”: Directly draw and expose patterns on live camera images—ideal for quick prototyping and precise electrode placement.

Precision & Stability

Automated Alignment: Achieve 250 nm accuracy with digital compensation for offset, rotation, and scaling.
Dynamic Autofocus: Ensures sharp, uniform features across varied substrates.
Environmental Control: Integrated chamber with temperature-controlled laminar airflow (±0.1°C) for consistent, repeatable results.

DWL 66+ | LASER LITHOGRAPHY SYSTEM

The ultimate lithography research tool: The DWL 66+ offers unmatched versatility, 200 nm resolution, and professional-grade grayscale with 65,536 levels. Ideal for R&D and prototyping. Fully customizable and proven in over 400 installations.... More Info Less Info

DWL 66⁺ Ultimate Lithography System ǀ Heidelberg Instruments

The DWL 66+ is a high-performance direct-write laser lithography system engineered for R&D and rapid prototyping across a wide range of microstructure applications, including MEMS, microfluidics, optics, photonics, and quantum devices.

It delivers the highest resolution on the market (down to 200 nm), professional-grade grayscale capabilities with 65,536 levels, and unmatched versatility through a fully customizable system configuration. With over 400 systems installed worldwide, it’s a proven solution for advanced research environments.

Key Features

Write Mode XR: Achieve 200 nm minimum feature size with exceptional speed and quality.
Grayscale Lithography: Outstanding surface quality in thick resists up to 150 µm.
Flexible Substrate Handling: Compatible with diverse materials, shapes, and sizes—including curved surfaces.
Real-Time Autofocus: Dual autofocus system ensures precision even on transparent or low-reflectivity substrates.
Interferometric Position Control: Guarantees high pattern fidelity and placement accuracy.

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