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GRITEC AG

Trutwisstrasse 9
Grüsch,  GR  CH-7214

Switzerland
http://www.gritec.ch
  • Booth: C2501


GRITEC AG - Swiss SEMICON Partner - performing your hightech

GRITEC develops and manufactures customized machines for various applications in the semiconductor industry.

Operating equipment, process systems, testing systems, coating systems, etc.

As Single point partner: You profit from one contact for the entire project, GRITEC takes responsibility for the end product. No ifs, ands or buts.

 Products

  • MicroStamp300
    High-precision system in the µm range using the wafer stamping process....

    • High-precision system in the µm range using the wafer stamping process.

    Individual configuration of process parameters such as process sequence, dispensing, force, etc. for various applications.
    -Wafers up to D300mm or edge length 300mm
    -Thicknesses in composite up to 20mm

  • MicroweldX
    Welding solutions for products in the semiconductor industry...

    • High-precision welding system for Class 8 cleanroom applications.
    Welding of external and internal circular seams with minimal material thicknesses and various product dimensions.
    Vacuum testing of products.
  • AligneX
    Plattform for High-precision alignment with adhesion and soldering of a laser sensor...

    • High-precision alignment with closed-loop feedback, including joining with soldering and bonding of electronic components.

    System accuracy in the micro range.

Categories

101 Photovoltaic Device Manufacturing
  • PV: Cells
  • PV: Modules
  • PV: Stand-Alone Systems
  • PV-Building-Integrated Solutions
    • 200 Packaging and Assembly Equipment
  • Ball Placement; Attach Systems
  • Base Loader Systems
  • Cleaning; Washing Equipment for Assembly & Packaging
  • Cut & Down Set; Trim; Form Equipment
  • Device Handling; Feeding Systems
  • Dicing; Sawing; Scribing; Separation Equipment
  • Die Bonding; Attach Equipment
  • Die Sorter; Pick & Place; Flip Chip Placement Systems
  • Dispensing Systems
  • Hot Embossing System
  • Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners
  • Marking; Imprinting; Labeling Equipment
  • Molding; Encapsulation; Decapsulation Equipment
  • Package Handling; Conveying Equipment
  • Package Simulation; Characterization Equipment
  • Solder Reflow; Soldering & Brazing Equipment
  • Wafer Level Bonders
  • Wafer Mount; Taping Equipment
  • Wire Bonding Equipment
    • 201 Flat Panel Display Equipment
  • Laser Treatment; Cutting Systems for Panels & Photocells
  • Panel Alignment; Cell Assembly Equipment
  • Spacer Spraying Equipment
    • 202 Other Equipment
  • Cutting; Drilling; Laser ablation; Beveling Equipment
  • Heating; Annealing; Curing Equipment - Furnaces; Conveyors; Ovens; Test Chambers; Heat Treating
  • Vacuum drying & out gassing Systems
  • Vision; ID; Bar Code Systems
  • Welding Equipment
    • 203 Inspection & Measurement Products
  • Centrifuges
  • Instruments; Bench Top Test
  • Leak Detection Systems - Vacuum or Gas
  • Package Inspection; Lead Scanners
  • Weight measurement; precision scales
  • Wire Bonding Inspection; Test
  • X-ray; XRF; 3-D X-Ray; LEXES Systems
    • 206 PV Equipment
  • Inspection and Metrology
  • Integration and Automation
    • 207 Process Equipment
  • Cleaning; Washing; Drying Equipment for Substrate, Fab Processing
  • Deposition; Chemical Vapor (CVD); MOCVD; PECVD; LPCVD; ALD; REALD; MVD
  • Deposition; Physical Vapor (PVD); Sputtering; Evaporation Equipment
  • Lithography; Exposure; Aligners; Direct Write Systems; Steppers; Scanners; Nanoimprint
  • Spin on Glass (SOG); on Dielectric (SOD) Track systems
    • 208 Test Equipment
  • Burn-In Systems
  • Environmental Stress Systems - Temperature; Humidity; Pressure; HAST
  • Handlers; Positioner Systems
  • System on a Chip (SOC); Mixed Signal Test Systems
  • Test Head Manipulators and Docking Stations

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