ADVANCED METROLOGY SOLUTIONS
for Fab & Lab
cyberTECHNOLOGIES is a global leader in high-end metrology solutions for semiconductor applications.
The portfolio spans from compact systems for labs and process qualification to fully automated, multi-sensor platforms with integrated material handling. Engineered for high-accuracy, throughput, and nonstop operation in fabs.
The systems are used worldwide by IDMs, foundries, and OSATs, supporting high-volume production and R&D with reliable nano-resolution, high-speed measurements across the process chain from front- to back-end.
cyberTECHNOLOGIES solutions support a wide range of applications, including:
- Wafer (Warp, Bow)
- Thickness & Thickness Variation (TTV / LTV)
- Thinfilm (down to 10 nm)
- Step Heights
- (µ-)Bumps, Pins, Pads & Pillars (e.g. Coplanarity, Position)
- Feature Sizes & Position
- Laser groove (e.g. Width, Chipping)
- Die Attach (e.g. Tilt)
- Chiplets (e.g. Parallelism, Rotation)
- Fillet Height
- 3D Wirebond (e.g. Sway, Clearance)
- Probe Cards (incl. Rework)
- Thermal Warpage Measurement
- Transparent Films & Coatings
- Thickfilm
- Roughness
…and MANY more.
See you in hall C1 at booth #1101!
www.cybertechnologies.com