D&X has been a trusted name in the semiconductor industry for over a decade,
driving innovation in both materials supply and wafer processing.
Based in Japan, we specialize in the R&D, manufacturing,
and global sales of essential semiconductor materials, including silicon wafers
and semiconductor tapes engineered for high performance and consistency.
We provide a comprehensive range of wafer processing services, such as dicing,
bonding, grinding, and film deposition, all tailored to meet the demanding
requirements of today’s semiconductor applications.
Our solutions are trusted by clients worldwide for their precision, reliability and speed.
Our Japan-made wafers can be customized to fit any technical specification,
ensuring compatibility with a wide variety of manufacturing processes.
Likewise, our semiconductor tapes are designed for durability, stability, and peak
performance in high-demand environments.
At D&X, we are committed to quality, speed, and customer satisfaction.
We pride ourselves on building long-term partnerships through
dependable service, technical expertise, and continuous innovation.
Contact us to explore how we can support your semiconductor needs.