Ulvac GmbH

Klausnerring 4
Kirchheim b. Munchen, 
Germany
http://www.ulvac.eu
  • Booth: B1139


ULVAC, solution Provider for Deposition/Etching/Ashing/Impl.

ULVAC GmbH was established in 1987 as the European subsidiary of ULVAC, Inc. Headquartered in Munich, Germany. From Munich our sales and service team serve EMEA region. ULVAC provides a very broad portfolio of manufacturing equipment for the vacuum, materials, and thin film industries. ULVAC’s solutions diversely incorporate equipment, materials, analysis, and services for semiconductors, MEMS, flat panel displays, electronic components, PCB, TFB. ULVAC delivers all types of vacuum products such as vacuum pumps and measurement and analysis equipment. ULVAC offers state-of-art products and technologies for semiconductor and related processes. To support MEMS, power devices, NVM fabrication ULVAC offers a line of sputtering, evaporation, plasma etch, ashing equipment, ion implanting, oxidation/POA/Nitridization, and activation annealing for both R&D and manufacturing. ULVAC has developed systems dedicated to advanced processing for thin film, lithium-ion battery manufacturing. This equipment range includes discrete (single) substrate battery fabrication for sputtering and evaporation. Come by our booth and discuss your processing needs with our sales professionals


 Products

  • Entron-EXX - Sputtering System
    Advancing semiconductor scaling using cutting edge technology Single and Tandem Platforms Maximize Productivity per unit space Up to 12 process modules...

  • Applications:
    Pad / RDL, Novel Channel Materials, 
    EUV / Multi Patterning HM,
    Stress Tuning Spacer, Barrier / Seed
    Advanced Logic
    DRAM
    NAND/NVM
    Packaging
  • ENVIRO Optima Resist Strip (Ashing) System
    Best in Class Ash Rate...

  • Descum/HDI/Polymer Residue removal
    Single wafer ashing with one, two or three modules
    100-300 mm wafer size
    240 WPH throughput
    Equipment front end module (EFEM) with
    4 integrated load ports
    RF downstream plasma with >12 µ/min ash rate
    Microwave source (option)
    Cold plate (option)
  • uGmni 200/300
    Common core platform for PVD, CVD, Ash, Etch ...

  • Applications:

    • Power device: Seed & Metal layer Sputtering
    • MEMS sensor: PZT Sputtering & Etching
    • Optical Device: VCSEL Etching
    • Packaging: Descum Ashing

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