Umicore Thin Film Products AG
Umicore’s Business Unit Metal Deposition Solutions (MDS) comprises two business lines: Electroplating (EP) and Thin Film Products (TFP). MDS is one of the world’s leading suppliers of products for precious metal-based surface coatings in the nano- and micrometer range. By combining the expertise, we offer two of the highest-quality technologies for surface finishing: electroplating and PVD coatings.
EP: Umicore provides advanced solutions for surface coating with precious metals, tailored to meet the requirements of various industries. For the semiconductor industry in particular, we offer innovative copper electroplating additives designed for advanced packaging applications. These include modular systems like IntraCu, which enable high-performance deposition for microbumps, RDL, filled vias, tall and mega pillars in advanced packaging. Applications concentrate on TGV, HBM, via filling and bonding applications.
TFP: Umicore is a leading developer and manufacturer of PVD materials for microelectronic, optoelectronic and optical thin film applications. We supply a broad portfolio of high quality products which include evaporation materials, sputtering targets, such as IBS and accessories.