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AP&S International GmbH

Obere Wiesen 9
Donaueschingen,  78166

Germany
http://www.ap-s.de
  • Booth: B1716


WE ARE YOU PARTNER FOR WET PROCESS EQUIPMENT.

AP&S International is a leading provider of chemical wet process equipment for the semiconductor industry. Among our customers are market-leading manufacturers of microchips, MEMS and optoelectronics worldwide. Characteristic for our machines are: high throughput, superior process performance, attractive TCO values and maximum flexibility (bridge tools and customized solutions). Our portfolio includes batch and single wafer equipment including manual, semi-automated and fully automated wet process machines as well as production supporting equipment like cleaners for FOUP, SMIF and boxes, laboratory equipment and chemical management systems. AP&S processing tools cover all common chemical wet processes used in semiconductor production chains, such as cleaning, etching, stripping, plating, developing, metal etching, e-less plating, lift-off and drying. Our equipment handles masks and wafers up to 300mm including different substrate thicknesses and wafer materials like silicium Si, silicium carbid SiC, gallium nitrid GaN, gallium arsenid GaAs, sapphire, glass.

The AP&S headquarters is located in Donaueschingen, Germany. The company's subsidiaries are in USA, China, Singapore and Malaysia.

 Products

  • Batch Processes
    High throughput, optimized process operating costs, comprehensive process control and consistent process results for vertical wafer processing. More: https://www.ap-s.de/en/products/#Batch...

    • The main feature of batch processes for the production of semiconductor devices and microelectromechanical systems (MEMS) is the simultaneous processing of multiple wafers on the front and back side. AP&S' batch wet process portfolio includes simple manual wet benches for laboratory or R&D purposes as well as fully automated high-end technology wet benches for mass production. Bridge tools for flexible wafer sizes are our strength!

    Due to the perfectly coordinated interaction of product design, automation and the required chemicals, our wet process solutions for batch processing offer maximum process reliability, optimized process times, cost efficiency and maximum flexibility.
    AP&S's wet benches enable cleaning, drying, etching, PR stripping and electroless deposition (e-less plating) for wafer processing up to 12 inches and masks of various sizes.

  • Single Wafer Processes
    High-precision processes with high uniformity, high repeatability and extremely precise process control for horizontal wafer processing. More: https://www.ap-s.de/en/products/#SingleWafer...

    • The main feature of batch processes for the production of semiconductor devices and microelectromechanical systems (MEMS) is the simultaneous processing of multiple wafers on the front and back side. AP&S' batch wet process portfolio includes simple manual wet benches for laboratory or R&D purposes as well as fully automated high-end technology wet benches for mass production. Bridge tools for flexible wafer sizes are our strength!

    Due to the perfectly coordinated interaction of product design, automation and the required chemicals, our wet process solutions for batch processing offer maximum process reliability, optimized process times, cost efficiency and maximum flexibility.
    AP&S's wet benches enable cleaning, drying, etching, PR stripping and electroless deposition (e-less plating) for wafer processing up to 12 inches and masks of various sizes.

  • Fab Logistic Tools
    FOUP, SMIF, carrier and box cleaners, wafer drying equipment and chemical management systems are also part of our portfolio. More: https://www.ap-s.de/en/products/#ProduktionsunterstuetzendesEquipment...

    • Our primary goal is to ensure efficient wet processes in our customers' semiconductor fabs. Therefore, our product range also includes fab logistics equipment such as FOUP and box cleaners, drying units for wafers, cleaning systems for quartz tubes, liners and boats, and chemical management systems.

    In this way, our customers receive everything from a single source and have a competent partner at their side for all relevant issues relating to wet-chemical processes in their semiconductor production.

Categories

200 Packaging and Assembly Equipment
  • Cleaning; Washing Equipment for Assembly & Packaging
  • Plating; Electro Chemical Plating for device assembly
    • 207 Process Equipment
  • Bumping Systems
  • Cleaning; Washing; Drying Equipment for Substrate, Fab Processing
  • Etching; Stripping; Ashing - Dry and Wet Equipment
  • Plating; Electro Chemical Plating; Deposition Systems
    • 500 Factory Monitoring & Control Systems (FMCS)
  • Chemical; Pure Water; Fluid Handling; Storage; Supply Systems
  • Chemical; Pure Water; Fluid Monitoring & Control Systems

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