Park Systems Europe GmbH

The PArk NX-Wafer ensure precise measurements and extensive data to enhance manufacturing processes and product quality. The Park NX-Wafer leads the industry in automated AFM metrology, offering comprehensive wafer inspection, automatic defect review, and CMP profile measurements. With unmatched nanoscale surface resolution and sub-angstrom accuracy, it maintains tip sharpness and delivers consistent results. Its automated features, such as auto tip exchanger and live monitoring, make it the premier AFM tool for semiconductor production and quality assurance.

Key Selling Points:

• True Non-Contact^TM Mode
• Automated Defect Review (ADR)
• Lowest Noise Floor in the Industry (<1Å)
• Excellent Tool-to-Tool Matching
• Automated Electrical Measurement available
• Hybrid Version available (incl. White Light Interferometer)

Applications:

• Sub-Angstorm Surface Roughness Measurement
• Defect Review and Analysis
• CMP (Chemical Mechanical Polishing) Profiling, Erosion and Dishing
• Trench and Pattern Metrology
• Tool Matching and Process Monitoring
• Wafer Edge Profiling

Introducing Park NX-Mask, an advanced solution for high-end application mask repair. Designed for inline production, it features an automated dual pod system for efficient mask handling. Utilizing AFM technology, it offers comprehensive capabilities for automatic defect review, repair, and verification, ensuring precision and effectiveness in the repair process. Enhance your production efficiency with Park NX-Mask.

Key Features:

• Safe and Superior Defect Repair

• Seamless Integration

• Depth Control of ±7.5 µm

• Automated Dual Pod Design

The Fully Automated Industrial AFM-WLI System is essential in the semiconductor industry as it influences device performance, size, and reliability. As manufacturers seek to create smaller, more powerful semiconductors, they encounter challenges like component integration, thermal management, material compatibility, and maintaining electrical integrity at higher frequencies. Park Atomic Force Microscopy solutions effectively tackle these challenges. With their precision and ability to examine nanoscale structures, Park AFM tools support manufacturers in addressing the complexities of advanced device packaging.

Key Features:

• Built-in WLI profilometry

• Motorized Filter Changer for PSI Mode

• Automated Motorized Linear Lens Changer

• Hotspot Detection and Review 

Introducing the Accurion EP4, our advanced imaging ellipsometer that expertly combines ellipsometry and microscopy. Its live ellipsometric-contrast feature allows for the detection of sub-nm details and the identification of key areas for detailed analysis, including thickness and refractive index mapping from 0.1 nm to 10 µm. Optional accessories are available for measurements in controlled environments or varying temperatures.

Key Features

• Simultaneous measurement of all pixels inside the field of view → Spectroscopic ellipsometry on each pixel
• Imaging Spectroscopic Ellipsometry from 190/250/360 nm to 1000/1700/2700 nm
• Highest lateral ellipsometric resolution of 1 µm, allowing determination of thickness and refractive index on microstructures as small as 1 µm
• Ellipsometric enhanced contrast images for a live visualization of the sample
• First identify, then measure: Intuitive selection of measurement region by drawing region in live view
• Parallel measurement of multiple regions within the selected field of view
• Knife-edge illumination for non-destructive suppression of disturbing backside-reflections
• Enlarge your measurement possibilities by using additional accessories, e.g. cells, temperature control or liquid handling
• Quality Control: also available as OEM version for QC in product lines