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RENA Technologies GmbH

Höhenweg 1
Gütenbach,  Baden-Württemberg  D-78148

Germany
http://www.rena.com
  • Booth: B1726


Welcome to RENA Technologies GmbH!

About RENA Technologies GmbH

RENA - The art of wet processing.

RENA Technologies is the worldwide technological leader for wet chemical equipment. 

We provide the most valuable, innovative wet-chemical solutions or our clients to reach the next level of state-of-the-art.
We manufacture highest quality flexible and high-throughput equipment for producing semiconductor products for all manner of different sectors.
RENA equipment is used to treat the surfaces of semiconductor wafers, like etching, plating, cleaning and drying with standardized machines and guaranteed processes or entirely customized equipment.

We have 3 manfacturing sites, 2 innovation hubs and more than 3,350 machines installed worldwide. We are constantly developing the most efficient process for our clients to achieve perfect surface quality. With more than 100 engineers, 150 global service experts at 20 service locations we work to make RENA machines a long-term success story.

For more information, visit https://www.rena.com


 Products

  • New Arrival: Vanguard
    Modular Single Wafer Cleaning...

  • Features and Benefits

    • 4 - 8 chamber single wafer cleaning
    • Internal chemistry preparation
    • Fully GEM300 compatible
    • Minimal chemical usage
    • Class 1 mini environment
    • Double-sided cleaning, up to 5 chemicals
    • Compact system footprint
    • Advanced IPA/DI water drying

    Learn More!

  • Convergence
    Fully automated Processing Platform...

  • ​Features and benefits

    • Dedicated versions for 200 and 300 mm
    • Precision - perfect process monitoring for tight process control
    • Fully customizable to any customer specification or wish
    • Full compliance with the SEMI standard
    • Carrierless or LMC processing
    • High throughput
    • Up to GEM300 compatible Stainless-steel version for Solvent application

    Learn more!

  • Revolution+
    Semi-automated wet bench for multi-step processes...

  • Features and Benefits

    • Dry-to-Dry Capabilities
    • Up to 200 mm wafer
    • Multi-Step Sequences with parallel processing
    • SECS/GEM compatible
    • Low footprint
    • Up to 125 wph
    • Optional FFUs
    • EFEM Versions available
    • Stainless-steel version for Solvent application

    Learn more!

  • ACE
    Advanced Chemical Etching for SiC-wafers...

  • Features and Benefits

    • Compact automated equipment
    • Essential for next generation power devices
    • Worlds first wet etching solution for SiC
    • Strain release
    • Defect removal

    Learn More! 

  • EPM 2
    Advanced manual electrochemical deposition...

  • Features and Benefits

    • Plating materials:
      Pure metals: Cu, Au, Ni, In, Sn, Pt 
      Alloys: SnAg, PbSn, FeNi
    • Inert or soluble anode
    • Different substrate sizes
    • Adjustable wafer thickness
    • Wide range of materials
    • Flexible recipe management
    • Easy maintenance

    Learn more!


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